Method for removing aging copper foil plating solution detrimental impurities

A technology of harmful impurities and electroplating solution, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of serious pollution of the environment, poor adsorption of harmful metals, short service cycle, etc., to achieve high adsorption purification rate, good economic benefits, selection strong effect

Inactive Publication Date: 2008-08-20
SHENYANG NORMAL UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention discards the plating solution in order to overcome the traditional industrial treatment method to the aging plating solution, which seriously pollutes the environment and the active carbon adsorption method to Cl - It has poor adsorption to harmful metals, and the adsorption of activated carbon has no selectivity. It also adsorbs high-concentration copper sulfate in the plating solution, so it is easy to be saturated and has short service life. It provides a method for removing harmful impurities in aging copper foil electroplating solutions. , this method is through the purification treatment process device of copper foil electroplating solution, adopts the combined adsorption method of activated carbon and ion exchange resin, and removes Zn, Fe, Cr, Pb with higher concentration in the electroplating solution under the premise of not discarding the plating solution , Sb, As and other harmful metal ions, Cl - and organic pollutants, specifically through the following steps:

Method used

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  • Method for removing aging copper foil plating solution detrimental impurities

Examples

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Effect test

Embodiment 1

[0020] First make the valves on each pipeline in the purification treatment process device be in a closed state, store the processed aging electroplating solution in the storage tank 1, start the corrosion-resistant pumps 7, 8, 9, and turn the corresponding valves 12, 13, 14 Open, the processing speed is controlled at 0.3m 3 / h;

[0021] The electroplating solution flows through the activated carbon column 2 (using coconut shell granular activated carbon 10-20 mesh) in the pipeline for adsorption to remove organic impurities and a small amount of harmful metal ions;

[0022] After the electroplating solution flows out from the activated carbon adsorption column 2, it enters the strong acid resin column 3 (resin model used: strong acid 001×7), so that the higher concentration of Zn, Fe, Cr, Pb, Sb, As and other trace metal ions in the plating solution remove;

[0023] The electroplating solution enters the weak base resin column 4 after flowing out from the strong acid resin ...

Embodiment 2

[0025] First make the valves on each pipeline in the purification treatment process device be in a closed state, store the processed aging electroplating solution in the storage tank 1, start the corrosion-resistant pumps 7, 8, 9, and turn the corresponding valves 12, 13, 14 Open, the processing speed is controlled at 0.4m 3 / h;

[0026] The electroplating solution flows through the activated carbon column 2 (using coconut shell granular activated carbon 10-20 mesh) in the pipeline for adsorption to remove organic impurities and a small amount of harmful metal ions;

[0027] After the electroplating solution flows out from the activated carbon adsorption column 2, it enters the strong acid resin column 3 (resin type: strong acid 001×10;), so that the higher concentration of Zn, Fe, Cr, Pb, Sb, As and other trace metals in the plating solution ion removal;

[0028] The electroplating solution enters the weak base resin column 4 after flowing out from the strong acid resin col...

Embodiment 3

[0030] First make the valves on each pipeline in the purification treatment process device be in a closed state, store the processed aging electroplating solution in the storage tank 1, start the corrosion-resistant pumps 7, 8, 9, and turn the corresponding valves 12, 13, 14 Open, the processing speed is controlled at 0.5m 3 / h;

[0031] The electroplating solution flows through the activated carbon column 2 (using coconut shell granular activated carbon 10-20 mesh) in the pipeline for adsorption to remove organic impurities and a small amount of harmful metal ions;

[0032] After the electroplating solution flows out from the activated carbon adsorption column 2, it enters the strong acid resin column 3 (resin type: strong acid 001×8;), so that the higher concentration of Zn, Fe, Cr, Pb, Sb, As and other trace metals in the plating solution ion removal;

[0033] The electroplating solution enters the weak base resin column 4 after flowing out from the strong acid resin colu...

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Abstract

The invention provides a method for removing hazardous matters in plating bath of an ageing copper foil, aiming at overcoming the defects of the traditional industrial processing method that ageing plating bath is discharged, which seriously pollutes environment and activated carbon has poor absorbability for CI<-> and poisonous metal and the absorption of the activated carbon does not have selectivity and copper sulphate with high concentration in the plating bath is also absorbed, thus being easily saturated, having short period, etc. The method uses a purification processing unit, adopts absorption combining activated carbon and ion exchange resin. On the premise that the plating bath is not discarded, hazardous metal ions such as Zn, Fe, Cr, Pb, Sb, As, etc. and organic pollutants with comparatively high concentration in the plating bath are removed. Highly acidic ion exchange resin and weakly alkaline ion exchange resin are respectively contacted with a regenerant and are produced after reaching saturated absorption. The method for removing hazardous matters in plating bath of the ageing copper foil has the advantages that on the premise that the plating bath is not discarded, the hazardous metal ions, Cl<->, organic pollutants with comparatively high concentration in the plating bath are removed; the method for removing hazardous matters in plating bath is characterized by high purification rate, strong selectivity and having resin reproduced that can be reused and does not pollute environment, etc., thus having good economic benefits.

Description

Technical field: [0001] The invention relates to a method for recyclable electroplating solution, in particular to a method for removing harmful impurities in aged copper foil electroplating solution. Background technique: [0002] As an important raw material for printed circuit boards, copper foil has increasingly stringent requirements on its performance. The quality of the electroplating solution is an important factor affecting the performance of copper foil. In the process of recycling and supplementing the electroplating solution, new impurities are continuously introduced. When some impurities accumulate in the plating solution to a certain concentration, the copper foil coating cannot reach the surface roughness, elongation, tensile strength, hardness and other products. Quality requirements. The traditional industrial treatment method for aging plating solution is to recover the main metal ions in the plating solution, and then discard the plating solution, which...

Claims

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Application Information

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IPC IPC(8): C25D21/18
Inventor 康艳红赵岩
Owner SHENYANG NORMAL UNIV
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