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Rectangle plane magnetron sputtering cathode

A magnetron sputtering and planar technology, applied in the field of vacuum coating equipment, can solve the problems of affecting the stability of the sputtering process, the deterioration of the vacuum sealing performance of the target material, and changing the parameters of the sputtering process, so as to overcome the difficulty of disassembly and assembly and reduce the cooling effect. Uniform and sufficient effect, stable sputtering process

Inactive Publication Date: 2008-08-27
HEFEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The non-uniform erosion of the target material seriously reduces the utilization rate of the target material, changes the parameters in the sputtering process, and even causes arcing or arc running, which seriously affects the stability of the sputtering process;
[0006] 2. Since the target is not sufficiently cooled, the target is prone to cracking, sublimation and melting, and the thermal deformation of the target will cause difficulties in disassembly, target expansion and cut-off screws, and poor vacuum sealing.

Method used

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  • Rectangle plane magnetron sputtering cathode
  • Rectangle plane magnetron sputtering cathode
  • Rectangle plane magnetron sputtering cathode

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Embodiment Construction

[0030] Referring to Fig. 1, the present embodiment has a target material 27, a cathode assembly and a shield 2 arranged on the periphery of the cathode assembly according to a conventional structure. In the cathode assembly, the magnetic circuit mechanism is fixedly arranged on the target holder 30 and is located inside the cathode body 7 , the target material 27 is fixedly arranged on the lower part of the target holder 30 .

[0031] In this embodiment, a magnetically conductive plate 23 is provided on the outer periphery of the cathode assembly, on the inside or outside of the shielding case 2 . The magnetically conductive plate 23 can be fixedly arranged on the outer sidewall of the cathode body 7, or fixedly arranged on the inner sidewall of the shield cover 2, or can be fixedly arranged on the outer sidewall of the shield cover 2; the magnetically conductive plate 23 adopts a magnetically conductive ferromagnetic material or soft magnetic material.

[0032] In specific i...

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Abstract

The invention relates to a rectangular plane magnetically controlled sputtering cathode, which is provided with a target, a cathode component and a shielding case which is arranged on the periphery of the cathode component, wherein a magnetic circuit mechanism is fixedly arranged on a target seat and is located inside a cathode body, the target is fixedly arranged on the lower portion of the target seat, and the cathode is characterized in that a magnetic conductive plate is arranged on the periphery of the cathode component and located on the inner side and the outer side of the shielding case in a whole circumference mode. The cathode of the invention can effectively increase the stability of a sputtering process and can increase the availability ratio of the target.

Description

technical field [0001] The invention relates to vacuum coating equipment, more specifically a rectangular planar magnetron sputtering cathode. Background technique [0002] Rectangular planar magnetron sputtering cathode is one of the important equipment for large-area vacuum coating. The invention patent "LINEAR PLANAR-MAGNETRON SPUTTERING APPARATUS WITH RECIPROCATING MAGNET-ARRAY" (inventor David E.Stevenson, US Patent, Patent No. 5328585) introduces a rectangular planar magnetron sputtering cathode, which has a rectangular planar Typical structure of a magnetron sputtering cathode. A shielding cover is arranged around the cathode body, the shielding cover is connected with the positive pole of the power supply and the ground wire, and a certain distance gap is reserved between the cathode body and the shielding cover. The function of the shield is to intercept the electrons emitted by the non-target parts, so that it does not generate glow discharge, prevent the sputter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 陈长琦郭江涛王君
Owner HEFEI UNIV OF TECH
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