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Method for modifying bisphenol A epoxy resin by using liquid crystal epoxy resin

A technology of epoxy resin and bisphenol, applied in the field of modification of bisphenol A epoxy resin, can solve the problem of poor economic benefit, difficult operation, inability to simultaneously significantly improve heat resistance and impact toughness of bisphenol A epoxy resin, etc. problems, to achieve the effect of improving impact toughness, improving heat resistance, excellent economic benefits and application value

Inactive Publication Date: 2008-09-10
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] At present, there are some shortcomings in the use of LCER to modify bisphenol A epoxy resin. For example, the heat resistance and impact toughness of the modified bisphenol A epoxy resin cannot be significantly improved at the same time. In this case, the scope of use of LCER modified bisphenol A epoxy resin is limited, and it is not easy to operate, and the economic benefit is poor

Method used

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  • Method for modifying bisphenol A epoxy resin by using liquid crystal epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The blending and curing of bisphenol A epoxy resin E51 and liquid crystal epoxy resin is made by the following ratio:

[0021] Bisphenol A Epoxy Resin E51 100g

[0022] Dihydroxybiphenyl diglycidyl ether (DGEBP) 8.0g

[0023] 24.8g of p-'-diamino-diphenyl-methane (DDM)

[0024] Weigh the above formula, add the solid substance DGEBP into the commercially available bisphenol A epoxy resin E51, heat and stir until the solid substance is completely dissolved and the solution is clear and transparent. At this time, the temperature is 150°C. Cool down to 70°C, keep the temperature and add 24.8g curing agent DDM, stir while vacuum defoaming, the vacuum degree is 0.1MPa, after the DDM and epoxy resin are mixed evenly and become a clear transparent liquid without air bubbles, pour into the mold , and then placed in an oven to gradually increase the temperature to solidify. The steps are: keep at 80°C for 2 hours, 120°C for 2 hours, 150°C for 2 hours, and 180°C for 3 hours. Re...

Embodiment 2

[0030] The blending and curing of bisphenol A epoxy resin E51 and liquid crystal epoxy resin is made by the following ratio:

[0031] Bisphenol A Epoxy Resin E51 100g

[0032] Diglycidoxyethoxyhydroquinone benzoate (PDEEB) 2.5g

[0033] 25.7g of p-'-diamino-diphenyl-methane (DDM)

[0034] Weigh the above formula, add the solid substance PDEEB into the commercially available bisphenol A epoxy resin E51, heat and stir until the solid substance is completely dissolved and the solution is clear and transparent. At this time, the temperature is 90°C. Cool down to 70°C, keep the temperature and add 25.7g of curing agent DDM, stir while vacuum defoaming, the vacuum degree is 0.1MPa, after the DDM and epoxy resin are mixed evenly and become a clear transparent liquid without air bubbles, pour into the mold , and then placed in an oven to gradually increase the temperature to solidify. The steps are: keep at 80°C for 2 hours, 120°C for 2 hours, 150°C for 2 hours, and 180°C for 3 hour...

Embodiment 3

[0036] The blending and curing of bisphenol A epoxy resin E51 and liquid crystal epoxy resin is made by the following ratio:

[0037] Bisphenol A Epoxy Resin E51 100g

[0038] Diglycidoxyethoxyhydroquinone benzoate (PDEEB) 4.0g

[0039] Methylhydroquinone 4-glycidoxyethoxybenzoate (MPDEEB) 3.0g

[0040] 29.3g of p-'-diamino-diphenyl-methane (DDM)

[0041] Weigh the above formula, add the solid substances PDEEB and MPDEEB into the commercially available bisphenol A epoxy resin E51, heat and stir until the solid substances are completely dissolved and the solution is clear and transparent. At this time, the temperature is 115°C. Naturally cool down to 70°C, keep the temperature and add 29.3g of curing agent DDM, stir and vacuum defoam at the same time, the vacuum degree is 0.1MPa, after the DDM and epoxy resin are mixed evenly and become a clear and transparent liquid without air bubbles, pour into Put it into the mold, and then put it into the oven to gradually increase the ...

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Abstract

The invention relates to a method for modification of bisphenol A epoxy resin with liquid crystal epoxy resin. The method comprises the following steps that: the bisphenol A epoxy resin is mixed evenly with the liquid crystal epoxy resin at a temperature ranging between 90 DEG C and 150 DEG C; then, a natural cooling down method is adopted to reduce system temperature to 70 DEG C, and a curing agent is added and stirred while the temperature is kept at 70 DEG C; meanwhile, vacuum defoamation is carried out; then, gradient warming-up curing is carried out for 2 hours at 80 DEG C, 2 hours at 120 DEG C, 2 hours at 150 DEG C and 3 hours at 180 DEG C so as to obtain the modified bisphenol A epoxy resin finally; moreover, the mass proportion of the added components is as follows: bisphenol A epoxy resin: liquid crystal epoxy resin: curing agent is equal to 100:2-8:20-30. The method can substantially improve the impact toughness and the heat resistance of the bisphenol A epoxy resin, the maximum values of the impact toughness and the heat distortion temperature of the modified bisphenol A epoxy resin are respectively 45.0kJ / m<2> and 153.6 DGE C, i.e. 2.4 times than the impact toughness of pure epoxy resin after curing and 17 DEG C higher than the prior heat distortion temperature; therefore, the method has good economic benefit and application value.

Description

technical field [0001] The invention relates to the modification of bisphenol A epoxy resin, in particular to a method for modifying bisphenol A epoxy resin with liquid crystal epoxy resin (LCER). Background technique [0002] Bisphenol A epoxy resin is an important class of thermosetting resin and the most widely used matrix resin in polymer composite materials. It has excellent adhesive properties, wear resistance, mechanical properties, electrical insulation properties, chemical stability, resistance High and low temperature performance, low shrinkage, easy processing and low cost, it is widely used in the fields of adhesives, electronic instruments, light industry, construction, machinery, aerospace, coatings, electronic and electrical insulation materials and composite materials. [0003] However, the cured bisphenol A epoxy resin is a thermosetting material with a high degree of crosslinking, resulting in typical brittle expansion, so its brittleness is relatively larg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/17C08J3/00
Inventor 刘国栋李卿张广林高俊刚
Owner HEBEI UNIV OF TECH