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Positive photoresist

A positive photoresist and solvent technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problem of high dependence and achieve the effect of improving the flatness and uniformity of the film surface

Active Publication Date: 2012-01-11
ECHEM SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the slit blade coating method, because it does not have a spin coating mechanism, it only relies on a slit blade with a 50-100 μm slit to coat. The known spin coating method uses the rotation mechanism to have It helps to improve the uniformity of the coating film, while the slit scraper method can only adjust the moving speed of the slit scraper, the amount of photoresist output of the slit scraper, and the distance from the slit scraper to the glass surface. To improve the uniformity of the coating film, The uniformity must be controlled by the fluid properties of the positive photoresist itself, so the slit blade coating method is more dependent on the properties of the positive photoresist than the spin coating method

Method used

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  • Positive photoresist
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Embodiment Construction

[0018] The following are the components of the composition of the positive photoresist of the present invention, which are described in detail respectively as follows:

[0019] (A) Resin:

[0020] The resin used in the positive photoresist of the present invention is a polymer substance, which can be novolac resin (Novolak, novolac resin), and the molecular weight (Mw) used is lower than 20,000, and it is better if it is lower than 10,000. Low molecular weight contributes to better flow flatness of the coating and a flatter coating surface.

[0021] (B) Additives:

[0022] The used additive of the positive photoresist of the present invention is a surfactant, which can be used to adjust the coating flatness of the positive photoresist on the glass substrate surface, with neutral (nonionic) surfactant and molecular weight (Mw ) greater than 500 is preferred, and its main component may be a silicon-containing, carbon-containing or fluorine-containing surfactant.

[0023] (C) ...

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PUM

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Abstract

The invention discloses a plus photoresist which comprises resin, an additive and a solvent, wherein, the solvent of the plus photoresist comprises at least two kinds of solvent with different boiling points.

Description

technical field [0001] The invention relates to a positive photoresist, and in particular to a positive photoresist suitable for a slit doctor blade coating method. Background technique [0002] Photoresists are light-sensitive films used to transfer images to substrates. A photoresist coating is formed on the substrate, and then the photoresist layer is exposed to an activating radiation source through a photomask. Since the photomask has some regions that are opaque to the activating radiation and other regions that are transparent to the activating radiation, the photoresist layer can be controlled. The shape of the photoresist layer exposure. Exposure to activating radiation provides light-induced chemical conversion in the photoresist coating, transferring the image of the photomask to the photoresist-coated substrate. After exposure, the photoresist is developed to provide a relief image that allows selective processing of the substrate. [0003] Photoresist is clas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039
Inventor 郭光埌盐田英和蔡哲辉杨宗穆
Owner ECHEM SOLUTIONS