System for processing thin-film material surface using bi-medium to block electric discharge

Abstract

The present invention provides a system of processing film material surface by a dual dielectric barrier discharge, including a high frequency power supply, a motor, discharge electrodes and an electrode casing, the discharge electrodes are composed by upper and lower metal tube electrodes which are multi-group parallel, covered by glass tubes or ceramic tubes and has same gap between electrodes, the two insulation material tubes covering the upper and lower metal tube electrodes form a dual dielectric between electrodes, the two ends of the upper and the lower electrode tubes are connected with a bearing respectively, the upper electrode tube is rotary driven by the motor, the lower electrode tube is rotary driven by the film penetrating through two electrodes, the upper and the lower metal tubes are connected with the high frequency power supply respectively, the upper and lower electrode tubes are placed in one casing, when the film material penetrates through the upper and lower metal tube electrodes, the surface is processed with modification treatment by plasma.

Description

technical field [0001] The invention relates to a system for treating the surface of thin film materials by double-dielectric barrier discharge, especially refers to a system in which multiple groups of metal tube electrodes are respectively covered with glass tubes or ceramic tubes, and the electrodes rotate by themselves when the discharge is in progress, and can pass through between the electrodes. Discharge device for thin film materials. Background technique [0002] Plasma technology has only been developed rapidly in recent years and has been widely used. For example, it can be used for: (1) Silicon wafer cleaning in the microelectronics industry, replacing the current acid and deionized water cleaning. (2) Clean all biologically and chemically contaminated surfaces, including surfaces and spaces contaminated by biological and chemical weapons. (3) Instead of wet chemical method, it can be used for in-situ disinfection in pharmaceutical and food industries. (4) Used...

AI Technical Summary

Problems solved by technology

[0003] The dielectric barrier discharge in the air generally places an insulating medium between the two electrodes. The discharge is directly punctured air, and the local micro-arc current generated by the discharge is relatively large. When it is used to process polymer materials, it is easy Local ablation occurs on the surface of the material, the local damage to the material surface is relatively large, and the treatment of the material surface is uneven, thus affecting the properties of the material surface

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