Electrical discharge grinding device for semiconducting ceramic rotating surface with tracking-electrode

Abstract

The invention relates to an electrical machining device of engineering ceramic materials, in particular to a semiconducting ceramic rotary surface discharge grinding machining device with a tracking electrode. The device aims at eliminating the phenomenon that the resistance of a work piece in a discharge channel is changed along with the change of the electric discharge machining part, thus ensuring the consistency of the pulse discharge energy during the machining process and further ensuring the consistency of the discharge erosion amount and the machining quality. The device connects a cathode of a pulse power supply of a wire cutting machine with an electrode wire, an anode is connected with a ceramic work piece by the self-adaptive variable diameter tracking electrode, the tracking electrode device is utilized to lead the electrodes of the pulse power supply of the wire cutting machine to slide correspondingly to the work piece, thus maintaining the resistance of the work piece between a feeding end and a discharge point constant. The invention changes the machining mode that the electrodes of the original pulse power supply are connected on a work bench, and the power supply is just carried out at the clamping position of the work piece.

Description

technical field [0001] The invention relates to an electrical processing device for engineering ceramic materials, in particular to a semiconducting ceramic rotary surface discharge grinding processing device with tracking electrodes. Background technique [0002] Engineering ceramic materials have excellent properties such as high hardness, wear resistance, high temperature resistance, and corrosion resistance, but it is difficult to remove them by traditional methods, which seriously restricts their popularization and application in the actual engineering field. The rotary surface occupies a large proportion of the shape elements of the part, but at present the rotary surface processing of engineering ceramic materials is mainly done by diamond grinding wheel grinding, which has low processing efficiency and high cost. Many engineering ceramics (such as boron carbide, titanium carbide, titanium dioxide, etc.) have certain electrical conductivity and are often called semico...

AI Technical Summary

Problems solved by technology

[0003] However, in the process of using wire cutting machine to discharge and grind the rotating surface of semiconducting ceramics, since the volume resistivity of semiconducting ceramic materials is much larger than that of metal materials, if only the spindle rotating device is used to supply power at the spindle chuck, the discharge channel The workpiece resistance value in will change with the change of EDM position, which will inevitably lead to the change of pulse discharge energy

However, WEDM uses pulse discharge energy to etch metal, so the change of pulse discharge energy will inevitably lead to uneven surface quality and inconsistent processing efficiency, and even seriously affect the smooth progress of processing.

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