Black solder resist compound and cured product thereof

A technology of solder resist and composition, applied in the field of solder resist, which can solve the problems of low exposure sensitivity and resolution, insufficient photocuring, and difficulty in obtaining high resolution, etc.

Active Publication Date: 2008-10-08
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for the conventional black photo solder resist whose content rate of the black pigment is increased in order to increase the blackness, the exposure light used for photocuring is absorbed by the black pigment, and the photocuring is not sufficiently performed, s

Method used

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  • Black solder resist compound and cured product thereof
  • Black solder resist compound and cured product thereof

Examples

Experimental program
Comparison scheme
Effect test

Example

[0097]

[0098] The varnish A obtained in the synthesis of the aforementioned carboxyl group-containing resin and the components shown in Table 1 were kneaded at the mixing ratio described in Table 1 with a three-roll mill to obtain a black solder resist composition.

[0099]

[0100] With respect to the solder resist compositions of Examples 1 to 4 and Comparative Examples 1 to 3, the performance was evaluated according to the following evaluation criteria. The results are shown in Table 2.

[0101] Performance evaluation:

[0102] (1) Color difference meter

[0103] The solder resist compositions of the above-mentioned Examples 1 to 4 and Comparative Examples 1 to 3 were respectively coated on the entire surface of the copper-clad substrate by screen printing, and dried in a hot-air circulating drying oven at 80°C for 30 minutes, and then , Using the cumulative light meter manufactured by ORC MANUFACTURINGCO., LTD., on the resist at 500mJ / cm 2 The amount of light is irradiate...

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Abstract

The present invention provides a black optical resistance flux with sufficient blackness degree and excellent resolving capability and condensate thereof. The black soldering inhibitor composition contains (A) carboxy group resin, (B) initiators for photopolymerization, (C) fluidifying agent, (D) multi- function epoxides at least having two epoxy radicals in one molecule, (E) blackness colorant, (F) more than one colorant except black colorant.

Description

technical field [0001] This invention relates to solder resists for forming permanent masks for printed circuit boards. More specifically, the present invention relates to a black solder resist which is suitable for printed circuit boards with higher density and finer lines, and which has a deep black tone and excellent resolution. Background technique [0002] In recent years, the technical field of semiconductors has made remarkable progress. With this, the integrated circuit has also changed from the LSI era to the super-LSI era. For electronic equipment, smaller machines, thinner, lighter machines, and so-called short and light machines are rapidly becoming smaller and lighter. develop. Printed circuit boards are also becoming denser and thinner accordingly, and more and more high-precision and high-performance devices are required. [0003] In order to meet this demand, for the solder resist layer formed as a permanent mask on the outermost layer of the printed circui...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCG03F7/0047G03F7/0048G03F7/027G03F7/038G03F7/0388G03F7/105H05K3/287H05K3/3452
Inventor 山本修一植田千穗
Owner TAIYO INK MFG
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