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Method for processing outer casing of bulk amorphous alloy electronic product and processing device

A technology for amorphous alloys and electronic products, which is applied in the field of processing methods and processing devices for bulk amorphous alloy electronic product shells, and can solve the problem of product performance that is difficult to meet higher load-bearing requirements, casting defects that are difficult to eliminate, and wall thickness that cannot be exceeded Thin and other problems, to achieve the effect of simple structure, uniform heating and convenient operation

Inactive Publication Date: 2008-11-05
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the shortcomings of the existing large amorphous alloy electronic product shell processing technology, such as complicated process, difficult to eliminate casting defects, too thin wall thickness, and difficult to meet higher load-bearing requirements for product performance, one of the purposes of the present invention is to provide a A method for processing electronic product casings by vacuum-assisted forming using the viscous flow behavior of bulk amorphous alloys in the supercooled liquid phase region

Method used

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  • Method for processing outer casing of bulk amorphous alloy electronic product and processing device
  • Method for processing outer casing of bulk amorphous alloy electronic product and processing device
  • Method for processing outer casing of bulk amorphous alloy electronic product and processing device

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Embodiment 1

[0029] Combine below figure 1 and figure 2 This embodiment will be specifically described.

[0030] The processing device of the present invention is composed of a resistance wire 1 , a large amorphous alloy slab 2 , an upper plate 3 , an electric heating tube 4 , a vacuum pump 5 , a thermocouple 6 and a die 7 . Wherein: the large amorphous alloy slab 2 is placed between the upper pole plate 3 and the die 7, and is deformed under the joint action of the compressed air in the upper pole plate 3 and the vacuum in the inner cavity of the die 7. The upper pole plate 3 is assembled on the upper part of the large amorphous alloy slab 2. The upper pole plate 3 has a concave structure, and the top surface of the concave structure has air holes. The slabs 2 are crimped to form a compressed air chamber, and the upper plate is used for pressing the large amorphous alloy slab, heating and feeding compressed air to form the large amorphous alloy slab; the inner side of the concave struc...

Embodiment 2

[0040] Combine below figure 1 and image 3 This embodiment will be specifically described.

[0041]The processing device of the present invention differs from Embodiment 1 in that: the die 7 has a hole at the key (button) position of the shell.

[0042] Processing technology of the present invention comprises the steps (see figure 1 ):

[0043] (1) According to the specific outline of the electronic product shell to be processed, design and process the upper plate 3 and the die 7, and select 110×70×0.7 (thick) mm Zr 65 al 10 Ni 10 Cu 15 Large amorphous alloy slab 2 . The large amorphous alloy slab 2 is placed in a heating furnace to start heating, and the heating temperature is between 400°C and 430°C (420°C is taken as an example in this embodiment).

[0044] (2) After the temperature in the heating furnace is stable, take out the large amorphous alloy slab 2 and place it on the top of the die 7 , and the die 7 is heated by the electric heating tube 4 . The upper pol...

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Abstract

The invention relates to the technical field for processing the shell of the electronic products, in particular to a processing method and a device of electronic product of bulk amorphous alloy. The method and the device of the invention overcome the disadvantages of the existing shell processing technique of electronic product of bulk amorphous alloy, which is a complex processing method, being difficult to remove casting defect, being forbidden from making the thickness of the wall too thin and the product being unable to meet higher demand on loading, etc. The processing method is especially applied to processing thin shell components of electronic products of 3C class such as laptop computers, hand-held video cameras, digital cameras, cell phones, personal digital assistants (PDA), MP3 (MP4), U disks, etc. By utilizing the viscous flow in super-cooled liquid region of the bulk amorphous alloy, the alloy is made to be deformed and stuck to the inner wall of the concave module to complete the formation of the thin shall component. The processing device of the invention comprises an upper plate, a rough plate of the bulk amorphous alloy, a concave module, etc., wherein, the rough plate of the bulk amorphous alloy is arranged between the upper plate and the concave module and deformed under the combined action of compressed air in the upper plate and the vacuum of the inner cavity of the concave module. The invention has simple structure, convenient operation and no casting defect being difficult to be removed.

Description

technical field [0001] The invention relates to the technical field of electronic product casing processing, in particular to a processing method and a processing device for a bulk amorphous alloy electronic product casing, especially suitable for notebook computers, portable video cameras, digital cameras, mobile phones, PDA, MP3 (MP4 ), U disk and other 3C electronic product casings for the processing of thin shell-shaped parts. Background technique [0002] At present, the electronic information industry represented by 3C products is developing rapidly. In order to meet the market requirements of diversified product functions, miniaturized size, light weight, and stylish appearance, commercial applications of materials such as magnesium alloys, titanium alloys, and bulk amorphous alloys have emerged one after another. Among them, bulk amorphous alloys have the characteristics of high strength and toughness, large elastic limit, excellent corrosion resistance and wear res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D18/04B22D23/06
Inventor 程明张士宏张海峰王瑞雪
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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