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A high temperature resistant inorganic adhesive

A technology of inorganic adhesives and high temperature resistance, applied in the direction of inorganic adhesives, adhesives, etc., can solve the problems of low connection strength and poor heat resistance of bonding metal materials and composite materials, and achieve improved ablation resistance and thermal shock resistance High capacity, good heat resistance and easy operation

Inactive Publication Date: 2012-02-22
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the defects of poor heat resistance and low connection strength of bonding metal materials and composite materials in existing adhesives, and provides a high temperature resistant inorganic adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0006] Embodiment 1: The high-temperature-resistant inorganic adhesive of this embodiment is composed of an inorganic solvent and a curing toughening agent according to a mass ratio of 1:0.7 to 1.5; wherein the inorganic solvent is the reaction solution of aluminum phosphate and copper oxide, water glass or aluminum phosphate Solution; the curing and toughening agent is composed of 50 to 95 parts of inorganic curing agent and 5 to 50 parts of toughening and strengthening agent according to parts by weight; the inorganic curing agent is one or more of alumina, zirconia and silicon oxide Combination; the toughening agent is one or a combination of nano-carbon powder, Al-Si alloy powder, Ni powder, boron powder, silicon powder, carbon fiber, quartz fiber, and aluminum silicate fiber.

[0007] In this embodiment, when the inorganic curing agent is composed of two or more substances, they are mixed in any ratio.

[0008] In this embodiment, the particle diameters of alumina, zircon...

specific Embodiment approach 2

[0013] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the modulus of water glass is 2-3. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the mass concentration of the inorganic solvent aluminum phosphate solution is 4% to 5%. Others are the same as in the first embodiment.

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Abstract

A high temperature resistant inorganic adhesive relates to an inorganic adhesive. The invention solves the defects of poor heat resistance and low connection strength of bonding metal materials and composite materials existing in the existing adhesives. The high temperature resistant inorganic adhesive of the present invention is composed of an inorganic solvent and a curing toughening agent according to a mass ratio of 1:0.7 to 1.5; wherein the inorganic solvent is a reaction solution of aluminum phosphate and copper oxide, water glass or aluminum phosphate solution; the curing toughening agent According to parts by weight, it consists of 50-95 parts of inorganic curing agent and 5-50 parts of toughening and strengthening agent. The high temperature resistant inorganic adhesive of the invention has good heat resistance and high connection strength for bonding metal materials and composite materials.

Description

technical field [0001] The invention relates to an inorganic adhesive. Background technique [0002] The existing adhesive has the defects of poor heat resistance and low connection strength for bonding metal materials and non-metallic composite materials. Contents of the invention [0003] The invention aims to solve the defects of poor heat resistance and low connection strength of bonding metal materials and composite materials in existing adhesives, and provides a high-temperature-resistant inorganic adhesive. [0004] The high-temperature-resistant inorganic adhesive of the present invention is composed of an inorganic solvent and a curing toughening agent according to a mass ratio of 1:0.7 to 1.5; wherein the inorganic solvent is the reaction solution of aluminum phosphate and copper oxide, water glass or aluminum phosphate solution; the curing toughening agent According to parts by weight, it is composed of 50-95 parts of inorganic curing agent and 5-50 parts of to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J1/00
Inventor 冯吉才赵磊张丽霞
Owner HARBIN INST OF TECH
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