Nonaqueous cyanogen-free silver-plating solution

A cyanide-free silver plating and electroplating solution technology, which is applied in the field of electrochemical silver plating, can solve the problems of high cost of plating solution, inconvenient management and operation, and increased cost, and achieve good stability of plating solution, good bonding force, and fine plating bright effect

Inactive Publication Date: 2008-11-26
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with cyanide silver plating, there are still many shortcomings in cyanide-free silver plating. The main problems are: (1) The stability of the plating solution
The stability of many cyanide-free silver plating solutions is not good, whether it is an alkaline plating solution, an acidic plating solution or a neutral plating solution, there are problems with the stability of the plating solution to varying degrees, which brings inconvenience to management and operation, and also reduces the cost. increased by
(2) The cost of plating solution is higher
Therefore, there are only a few units currently using the cyanide-free silver plating process.

Method used

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  • Nonaqueous cyanogen-free silver-plating solution
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Examples

Experimental program
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Effect test

Embodiment 1

[0017] According to the non-aqueous cyanide-free silver-plating solution preparation method of the present invention, the following compounds are formulated into cyanide-free silver-plating solution AgCl22g / L

[0018] TU 70g / L

[0019] DMF as a solvent (quantitatively according to actual requirements)

[0020] Cysteine ​​0.5g / L

[0021] pH 7

[0022] Temperature 0℃~80℃

[0023] According to the electroplating step in the specific embodiment, the electroplating operation is performed using the cyanide-free silver plating electroplating solution.

Embodiment 2

[0025] According to the preparation method of non-aqueous cyanide-free silver-plating solution of the present invention, the following compounds are prepared into cyanide-free silver-plating solution

[0026] AgNO 3 22g / L

[0027] KSCN 130g / L

[0028] DMF as a solvent (quantitatively according to actual requirements)

[0029] pH 7

[0030] Temperature 0℃~80℃

[0031] According to the electroplating step in the specific embodiment, the electroplating operation is performed using the cyanide-free silver plating electroplating solution.

Embodiment 3

[0033] According to the preparation method of non-aqueous cyanide-free silver-plating solution of the present invention, the following compounds are prepared into cyanide-free silver-plating solution

[0034] AgNO 3 17g / L

[0035] KSCN 100g / L

[0036] Dimethyl sulfoxide is used as solvent (quantitatively according to actual requirements)

[0037] pH 7

[0038] Temperature 0℃~80℃

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Abstract

The invention discloses non-aqueous cyanide-free silver plating electroplating solution. The electroplating solution adopts an organic solvent instead of the water as a solvent. The concentration of every component in the electroplating solution is that a silver iron source is 1 to 200 grams per liter, a complxant is 1 to 800 grams per liter and an electroplating additive is 10 to 10000 milligrams per liter. Compared with the traditional technical formula of cyanide silver plating, the non-aqueous cyanide-free silver plating electroplating solution of the invention is very low in toxicity; compared with the cyanide-free silver plating water system plating solution, the solution of the invention has good stability and the silver particle cluster in the plating is smaller. Under the control conditions, the average particle radius is within 100 nanometers. The plating is fine and bright and has good binding force, which can be applied in the fields of decorative electroplating and functional electroplating and especially has better application in electronic chip micro channel electroplating and nano material preparation.

Description

Technical field [0001] The invention belongs to the technical field of electrochemical silver plating, and specifically relates to a non-aqueous, cyanide-free silver plating solution. Background technique [0002] The silver plating layer has high electrical conductivity, light reflection ability, high chemical stability to organic acids and alkali, and its price is relatively cheaper than other precious metals. It has been widely used in decorations, tableware, electronic products and other fields. So far, most of the silver electroplating processes at home and abroad still use the cyanide silver plating process to electroplat the silver layer. This is mainly because the plating solution has good stability, good throwing ability and depth capability, and the coating has fine crystallization and a silvery white appearance. However, cyanide is highly toxic and extremely harmful to the human body and the environment. Good exhaust equipment and wastewater treatment conditions a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46
Inventor 孙建军陈锦怀谢步高林志彬陈国南
Owner FUZHOU UNIV
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