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Magnesium boride granule enhancement type tin-silver-zinc compound solder and manufacture method thereof

A magnesium diboride, particle-enhanced technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as the inability to meet environmental protection, and achieve good mechanical properties, simple preparation methods, and long service life. Effect

Inactive Publication Date: 2008-12-17
太仓市南仓金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, researchers at Akron University in the United States added 1 to 2% titanium oxide nanoparticles to tin-lead solder to generate composite solder, which increased the microhardness of the solder by 50%. However, since the solder is still based on lead-containing solder, it cannot Meet the requirements of environmental protection

Method used

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  • Magnesium boride granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
  • Magnesium boride granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
  • Magnesium boride granule enhancement type tin-silver-zinc compound solder and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The magnesium diboride particle-reinforced tin-silver-zinc composite solder according to this embodiment includes tin-silver-zinc solder and 0.1% magnesium diboride particles. The average particle size of magnesium diboride is 8 μm, and in the tin-silver-zinc solder, the mass ratio of tin, silver and zinc is 95.6:3.5:0.9.

[0027] The solder in this example is recorded as: 0.1% MgB 2 Enhanced Sn-3.5%Ag-0.9%Zn, its preparation process is as follows:

[0028] ①. Heat the tin, silver and zinc with a purity of 99.99% to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and at the same time add magnetic stirring to make the alloy composition uniform, then water-cool and solidify, and then melt the alloy After turning over, reheat to 1200°C to melt, and at the same time, add magnetic stirring and water cooling, repeat this at least five times, and obtain a button-shaped tin-silver-zinc solder with a diameter of 3.0 to 3.5 cm;

...

Embodiment 2

[0031] The magnesium diboride particle-reinforced tin-silver-zinc composite solder according to this embodiment includes tin-silver-zinc solder and 0.5% magnesium diboride particles. The average particle size of magnesium diboride is 8 μm. The tin-silver-zinc solder is composed of tin, silver, zinc and indium in a mass ratio of 94.6:3.5:0.9:1.

[0032] Mark the solder for this example as: 0.5% MgB 2 Reinforced Sn-3.5%Ag-0.9%Zn-1%In, its preparation process is as follows:

[0033] ①. The tin, silver, zinc and indium with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified. Turn the alloy over and reheat it to 1200°C to melt, and at the same time add magnetic stirring and water cooling, so repeat at least five times to get a button-shaped tin-silver-zinc solder with a diameter of 3.0-...

Embodiment 3

[0036] The magnesium diboride particle-reinforced tin-silver-zinc composite solder according to this embodiment includes tin-silver-zinc solder and 1% magnesium diboride particles. The average particle size of magnesium diboride is 8 μm. The tin-silver-zinc solder is composed of tin, silver, zinc and gallium with a purity of 99.99% in a mass ratio of 94.6:3.5:0.9:1.

[0037] Label the solder for this example: 1% MgB 2 Reinforced Sn-3.5%Ag-0.9%Zn-1%Ga, its preparation process is as follows:

[0038] ①. The tin, silver, zinc and gallium with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon according to the formula ratio, and magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified. Turn the alloy over and reheat it to 1200°C to melt, and at the same time add magnetic stirring and water cooling, so repeat at least five times to get a button-shaped tin-silver-zinc solder wit...

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Abstract

The invention relates to a magnesium diboride particle reinforced type tin, silver and zinc composite solder and the preparation method. The magnesium diboride particle reinforced type tin, silver and zinc composite solder comprises a tin, silver and zinc solder and the magnesium diboride particles with 0.01-1 percent of the weight of the tin, silver and zinc solder; according to parts by weight, the tin, silver and zinc solder comprises 80-98 portions of tin, 0.1-5 portions of silver and 0.1-5 portions of zinc. The tin, silver and zinc solder, due to the addition of magnesium diboride, has better mechanical property, and can serve better under the working conditions of a thermal shock environment, with long service life. The preparation method of the solder of the invention is that, at first, button-shaped tin, silver and zinc solder is prepared; then under vacuum protection, magnesium diboride particles and button-shaped tin, silver and zinc solder are heated to 230-280 DEG C; after even stirring and cooling, the solder can be acquired, and the method is simple.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, in particular to an enhanced tin-silver-zinc composite solder and a preparation method thereof. Background technique [0002] At present, the research on new lead-free solder has become one of the important and frontier topics of material science. The development of lead-free solder products is a requirement of environmental protection and a major trend of world economic development. [0003] Solder joints, as the connection, electrical and heat conduction structures on the circuit board, bear most of the shear stress caused by the difference in thermal expansion coefficient between the electronic device and the substrate material. When the electronic equipment is repeatedly operated, the solder joints in the thermal cycle will Under the alternating action of shear force, the solder joints will crack and the electronic system will fail. Therefore, solders are required to have superior co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C1/02
Inventor 刘永长徐荣雷韦晨马宗青赵倩王文忠
Owner 太仓市南仓金属材料有限公司
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