Polysilicon directional freezing equipment

A technology of directional solidification and polysilicon, applied in polycrystalline material growth, crystal growth, single crystal growth, etc., can solve problems such as long process time, low primary conversion rate, increased material consumption, energy consumption cost, etc., and achieve low energy consumption , The effect of small side pollution

Inactive Publication Date: 2008-12-17
QINGDAO NEW ENERGY SOLUTIONS
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Problems solved by technology

The disadvantage of the Siemens method is that it adopts backward thermal chemical vapor deposition on the core side section of the process. There are too many side sections in the process and the conversion rate at one time is low, which leads to too long process time and increases material consumption and energy consumption. cost
Domestic directional solidification equipment generally pulls the crucible into the high temperature range of the heating element by pulling the ingot, which can

Method used

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  • Polysilicon directional freezing equipment

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Embodiment Construction

[0010] The specific embodiments of the solution will be described in detail below in conjunction with the technical solution and the accompanying drawings.

[0011] Put the polysilicon material 10 into the quartz crucible 24, put the quartz crucible 24 into the graphite crucible 23, cover the graphite cover 11, put the graphite crucible 23 on the graphite supporting platform 21 as a whole, close the equipment cover 8, and evacuate. First use the mechanical pump 5 to pump the vacuum to 10 2 Pa below, then use Rhodes pump 6 to pump the vacuum to 10 0 Below pa, raise the temperature of the upper graphite heating element 25, the side graphite heating element 9 and the lower graphite heating element 20 to 1500° C., and keep the temperature for 5 hours after the polysilicon material 10 is completely melted. First lower the temperature of the lower graphite heating element 20 at a rate of 2°C / mm so that the liquid silicon presents a thermal field distribution in which heat is dissip...

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Abstract

The invention discloses a directional freezing device for polysilicon, which belongs to the technical field of purifying the polysilicon through physical metallurgy techniques, and particularly relates to a polysilicon smelting device that uses a directional freezing method. An inner chamber of a shell of the directional freezing device for polysilicon is a vacuum chamber, and a closed heat preserving region inside the vacuum chamber is composed of an upper heat resisting and insulating fiber sleeve, a lateral quadrate heat resisting and insulating fiber sleeve and a lower heat resisting and insulating fiber sleeve; the middle part of the lower heat resisting and insulating fiber sleeve is opened with a tapered orifice, and a heat resisting and radiating fiber screen that is fixedly connected with a pull rod is inserted into the tapered orifice; the directional freezing device for polysilicon has a supporting platform which consists of a frame-shaped bracket, and a left slide pull rod and a right slide pull rod that are arranged on the frame-shaped bracket; the shell of the directional freezing device for polysilicon is fixed on the frame-shaped bracket. The directional freezing device for polysilicon effectively controls the radiating methods of the liquid polysilicon, ensures the temperature gradient to be kept in a same direction consistently, leads the liquid polysilicon to radiate in a single direction along the bottom, and finishes the directional freezing of the polysilicon. The directional freezing device for polysilicon has the advantages of low energy consumption and little environmental pollution.

Description

technical field [0001] The invention belongs to the technical field of purifying polysilicon by physical metallurgy technology, in particular to a device for smelting polysilicon by directional solidification. Background technique [0002] High-purity polysilicon is the main raw material for solar cells. The preparation of high-purity polysilicon abroad mainly uses the Siemens method, specifically the silane decomposition method and the gas-phase hydrogen reduction method of chlorosilane, in which SiHCl 3 The Siemens method is currently the mainstream technology for polysilicon preparation. SiHCl 3 The useful deposition ratio of the method is 1×10 3 , is SiH 4 100 times. The deposition rate of the Siemens method can reach 8-10 μm / min. The conversion efficiency of one pass is 5% to 20%, and the deposition temperature is 1100°C, second only to SiCl 4 (1200°C), the power consumption is about 120kWh / kg, and the power consumption is also relatively high. Domestic SiHCl 3...

Claims

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Application Information

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IPC IPC(8): C30B28/06C30B29/06
Inventor 谭毅李国斌
Owner QINGDAO NEW ENERGY SOLUTIONS
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