Cabinet, radiating device and method for installing the radiating device

Abstract

The invention relates to the technical field of heat dissipation, more particularly to a technique for heat dissipation of a chip mounted within a chassis. A chassis comprises: a metallic housing and the chip mounted within the chassis, and further comprises: a first metal sheet which is contacted with an external surface of the chip to form a thermal conduction connection; a metal fin, one end of which is in thermal conduction connection with the first metal sheet; a thermal conducting silica gel which is filled up between the other end of the metal fin and the metallic housing. The invention also provides a heat dissipation device and a mounting method thereof. The invention conducts heat of the chip to the housing of the chassis via the first metal sheet, the metal fin and the thermal conducting silica gel, such that the chip can not only dissipate the heat through the metal fin, but also dissipate the heat out of the chassis via the housing of the chassis, which remarkably strengthens effect of the heat dissipation; besides, as the materials for the first metal sheet and the metal fin are common, inexpensive and simple in processing, the cost is low.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to the heat dissipation technology for chips installed in the equipment case. Background technique [0002] Nowadays, more and more electronic products use large-scale integrated circuit chips. These chips have powerful functions and fast running speed, so the power consumption of the chips is also very large, and the requirements for heat dissipation are even higher. [0003] Usually, the chip is dissipated, and a heat sink can be added on the surface of the chip. A common radiator such as figure 1 As shown, including: base plate and fins. Both the bottom plate and the fins are made of metal materials with good thermal conductivity, such as alloy aluminum and copper. The bottom surface of the bottom plate is in contact with the chip surface, conducting the heat from the chip to the fins. The fins are composed of many metal sheets perpendicular to the bottom plate, so ...

AI Technical Summary

Problems solved by technology

[0007] However, the cost of the cooling chip in the above method is also relatively high, and an external power supply is required; and the production cost of making the rubber for heat conduction is relatively high.

And when the height and size of the chassis change, it is necessary to re-open the mold to make the heat-conducting rubber, resulting in an increase in cost

In addition, rubber has a limited efficiency in conducting heat, so the heat dissipation effect is also limited

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