Non solid electrolyte all tantalum capacitor and preparation thereof

A tantalum capacitor and electrolyte technology, applied in the field of electronic components, can solve the problems of low reliability, insufficient capacity of tantalum capacitors, poor back pressure resistance, etc., and achieve high reliability, strong back pressure resistance, and back pressure ability. improved effect

Active Publication Date: 2009-01-07
ZHUZHOU HONGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is: in order to overcome the shortcomings of the existing non-solid electrolyte tantalum capacitors with insufficient capacity, poor back pressure resistance and low reliability, the present invention provides a brand-new back pressure resistant large-capacity non-solid electrolyte tantalum capacitor and its The production method, the non-solid electrolyte tantalum capacitor has good reverse pressure resistance, larger capacity, and more stable and reliable performance

Method used

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  • Non solid electrolyte all tantalum capacitor and preparation thereof
  • Non solid electrolyte all tantalum capacitor and preparation thereof
  • Non solid electrolyte all tantalum capacitor and preparation thereof

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Embodiment 1

[0021] attached figure 1 A schematic diagram of the basic structure of the present invention is given. It can be seen from the accompanying drawings that the present invention is a non-solid electrolyte all-tantalum capacitor, which adopts a new non-solid electrolyte all-tantalum capacitor structure and its manufacturing process. A bidirectional energization method is adopted, and a layer of anti-back pressure TaO is attached to both sides of the anode sheet 1 and / or cathode sheet 2. 5 Metal oxide film medium, and adopts the sandwich structure of two layers of cathode sheet and one layer of anode sheet, the anode sheet 1 and the cathode sheet 2 are composed of porous tantalum core, around the anode sheet 1 and cathode sheet 2 in the capacitor shell 3, And the holes of the porous tantalum core of the anode sheet 1 and the cathode sheet 2 are all filled with non-solid electrolyte, through the back pressure TaO on the anode sheet 1 and / or cathode sheet 2 5 The metal oxide film g...

Embodiment 2

[0031] attached figure 2 A schematic diagram of another structure of the present invention is given. It can be seen from the accompanying drawings that the structural principle of the second embodiment is the same as that of the first embodiment, except that this embodiment adopts a double-layer anode sheet structure. figure 2Among them, the first layer of anode sheets 9 and the second layer of anode sheets 10 are alternately separated from the first cathode sheets 14, the second cathode sheets 15 and the third cathode sheets 16, and each layer of anode sheets is in contact with the cathode sheet. The first insulating layer 11, the first insulating layer 12, the third insulating layer 13, and the fourth insulating layer 14 are arranged between the surfaces; the first layer of anode sheet 9 and the second layer of anode sheet 10 are connected in series by a lead wire 15 and passed through the anode The lead wire 16 leads out, and the first cathode sheet 14 , the second cathod...

Embodiment 3

[0033] attached image 3 A schematic diagram of another structure of the present invention is given. It can be seen from the accompanying drawings that the structural principle of the third embodiment is the same as that of the first embodiment. image 3 Among them, the anode sheet 18 is an N-layer anode sheet with more than two layers, the cathode sheet 19 is an N+1 layer cathode sheet with more than three layers, and the insulating layer 20 is an N+2 layer insulating layer with more than four layers; the anode sheet 18 and the cathode The sheets 19 are staggered and separated to form a structure in which two cathode sheets clamp an anode sheet; all the anode sheets 18 are connected in series with lead wires and lead out through the anode lead wire 4, and all the cathode sheets 19 are connected in series with lead wires and then lead out through the cathode lead wire 5. All anode sheets are composed of porous tantalum cores, and a layer of metal oxide film media is attached t...

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PUM

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Abstract

The invention discloses a non-solid electrolyte all-tantalum capacitor and a preparation method thereof. The non-solid electrolyte all-tantalum capacitor comprises an enclosure, a cathode strip, an anode strip, a cathode lead, an anode lead and a gland, wherein, the cathode strip and the anode strip are arranged inside the enclosure; the cathode lead is connected with the cathode strip by penetrating the gland; the anode lead is connected with the anode strip by penetrating the gland; a porous tantalum core cathode strip produced by the pressing and sintering of tantalum metal powder is adopted, the two sides of the anode strip and / or the cathode strip are attached with a metal oxide film medium TaO5 for insulation and back pressure resistance; the cathode strip and the anode strip are of sandwich structure in which two layers of cathode strips clamp one layer of anode strip, an isolating and insulating layer is arranged between the anode strip and the cathode strip; the cathode strip consists of porous tantalum cores and the metal oxide film medium as the insulating layer can also be attached to the cathode strip; and the structures of the enclosure, the gland and the like of the capacitor are composed of tantalum material; The non-solid electrolyte is filled around the anode strip and the cathode strip as well as in the porous tantalum core pores of the anode strip and the cathode strip, thus the non-solid electrolyte all-tantalum capacitor is formed.

Description

technical field [0001] The patent of the invention relates to an electronic component, in particular to the design and manufacturing technology of a back pressure-resistant large-capacity non-solid electrolyte all-tantalum electrolytic capacitor. Background technique [0002] At present, with the rapid development of scientific and technological power, the scope of human activities is getting wider and wider, and there are more and more researches and explorations on space. The development of space technology has put forward higher requirements for electronic components. Today, a world-wide component revolution is brewing, and tantalum electrolytic capacitors, as an important branch of electrolytic capacitors, are widely used in communications, aerospace and military industries, submarine cables and advanced electronic devices, and civilian appliances. Super large capacity, low ESR, high frequency, high temperature, and high reliability are one of its main development direc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/00H01G9/042H01G9/048H01G9/08H01G9/022
Inventor 刘勇刚刘新军
Owner ZHUZHOU HONGDA ELECTRONICS
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