Laser beam processing method

A laser processing method and laser processing technology, applied in the directions of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of support body fracture, cutting support body pieces, etc., to improve yield, improve workability, increase Effects of laser power and movement speed

Active Publication Date: 2009-01-21
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in half-cutting with a laser, the support sheet may be completely cut due to the influence of the output stability of the laser oscillator, the workability and thickness of the support sheet in the laminated material.
[0004] In addition, even if the support sheet is not completely cut, due to the tension load applied to the support sheet during transportation, the support sheet may break starting from the damage to the support during laser processing.

Method used

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  • Laser beam processing method
  • Laser beam processing method
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Examples

Experimental program
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Effect test

Embodiment 1

[0040] [processed object]

[0041] In this embodiment 1, as a processed object, such as Figure 5 In the polarizing plate with a spacer (total thickness: 270 μm) having the structure shown, the polarizing plate 9 was cut and processed without laser processing the spacer 10 (thickness: 38 μm) as a support.

[0042] [Laser irradiation device]

[0043] The laser irradiation apparatus used is as follows.

[0044] Laser light source: carbon dioxide laser

[0045] Laser wavelength: 10.6μm

[0046] Maximum output power: 250W

[0047] [Laser irradiation conditions]

[0048] Half-cut processing of the polarizing plate with a separator was performed under the following conditions.

[0049] Laser power: 42W

[0050] Spot diameter: φ120μm

[0051] Repetition frequency: 20kHz

[0052] Scanning speed: 400mm / s

[0053] Number of scans: 1 time

[0054] Energy input per unit length: 0.105J / mm

[0055] Under the above-mentioned processing conditions, the half-cut processing of the p...

Embodiment 2

[0062] In this embodiment 2, as the processed object, such as Figure 5 In the polarizing plate 11 with a spacer (total thickness: 270 μm) having the structure shown, the polarizing plate 9 was cut and processed without laser processing the spacer 10 (thickness: 38 μm) as a support.

[0063] As the laser irradiation device, the same device as in Example 1 was used, and the laser irradiation conditions were as shown in Table 2 below, and the number of scans was 2 times. In addition, similarly to Example 1, the laser power was changed intentionally, and the range of the laser power which can perform a half-cut process was confirmed. As a result, an increase of 21W or less is considered to be a range in which half-cutting can be performed.

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PUM

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Abstract

The laser beam processing method according to the present invention is a laser beam processing method that performs shape processing on a work to a designated depth position using a laser beam, and is characterized in that the laser power of the laser beam and the relative moving speed between the work and the laser beam are made to be large, and the number of times of irradiation that is necessary for laser beam processing is made to be small so that the energy per unit length of the laser beam that is optimally set depending on the work is within an energy range that does not allow the work to be pierced even when the laser power increases due to a power fluctuation in the laser beam oscillator.

Description

technical field [0001] The present invention relates to a laser processing method and a laser processed product, which uses a laser to treat, for example, various sheets, circuit substrates, semiconductor wafers, glass substrates, ceramic substrates, metal substrates, semiconductor lasers and other light-emitting or light-receiving element substrates, MEMS substrates, Shape processing such as half-cut processing of processed objects such as semiconductor packages, cloth, leather, and paper. Background technique [0002] Recently, along with the miniaturization of electrical / electronic equipment, the miniaturization and high precision of parts have been progressing, and the contour processing of various materials is also pursuing high precision / high precision with a machining accuracy of ±50 μm or less. However, in punching such as conventional punching, the accuracy is at best about ±100 μm, and it is not possible to meet the accuracy requirements at present. Therefore, pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/38B23K26/08B23K26/082
CPCB23K26/409H05K2203/0207H05K3/0032B23K26/385B23K26/0626B23K26/389B23K26/40B23K2103/172
Inventor 松尾直之西田干司日野敦司
Owner NITTO DENKO CORP
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