Photomask, manufacturing method thereof and pattern transfer printing method
A manufacturing method and photomask technology, applied in the field of photomasks, can solve the problems of structural cost obstacle, impossible application, difficulty in exposure machine resolution and large light quantity, etc., and achieve the effect of improving resolution and simple manufacturing.
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[0078] Hereinafter, the present invention will be further specifically described through examples.
[0079] A synthetic quartz substrate was used as a transparent substrate, and a semitransparent film made of a MoSi compound was formed with a predetermined film thickness on the transparent substrate by a sputtering method. This semi-transmissive film has a transmittance of 50% in the g-line within the exposure light (wavelength range of 365 nm to 436 nm) of the exposure machine used for pattern transfer described later (assuming that the transmission of the exposure light of the transparent substrate rate is 100%) to set the film thickness. In this case, the phase difference of the exposure light transmitted through the portion where the light semitransmissive film is formed relative to the exposure light transmitted through the transparent substrate is less than 60 degrees. Then, a positive photoresist is coated on the semitransparent film to prepare a photomask.
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