Method for improving etching depth accuracy

A technology of etching depth and accuracy, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inaccurate exposure rates, improve production efficiency, avoid scrap, and save manpower and material resources.

Inactive Publication Date: 2009-01-21
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
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Problems solved by technology

[0006] In order to solve the above problem of inaccurate exposure rate, a method to improve the accuracy of etching depth is proposed, which can effectively ensure the accuracy of exposure rate and improve chip performance

Method used

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  • Method for improving etching depth accuracy
  • Method for improving etching depth accuracy

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Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0015] figure 1 It is a schematic diagram of the program determination of the present invention. The first row of the table represents different products; the second row of the table represents the exposure rate; the third row of the table represents the actual time, that is, the actual etching time required based on experience; the fourth row of the table represents The estimated time is the previously estimated etching time before etching; the fifth column indicates the depth, that is, the etching depth, and the actual time can be obtained according to the mentioned depth. Such as figure 1 As shown, there is a large discrepancy between past estimated times and actual times. In the present invention, different programs are applied to samples from the actual etched products, and the time of the programs is the average value of the actual ti...

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Abstract

A method for improving the deepness and the accuracy of etching, which belongs to the field of the technical process of a semi-conductor and comprises the following steps: firstly, classifying products according to the exposure rate, secondly, applying different etching formulas according to the classification of the exposure rate of the products. The method of the invention guarantees the exposure rate of products, improves the performances of a chip and the production efficiency, and saves human and material resources.

Description

technical field [0001] The invention relates to the field of semiconductor technology, in particular to a method for improving the accuracy of etching depth. Background technique [0002] In the integrated circuit manufacturing process, it is generally divided into steps such as oxidation, photolithography and etching, doping, annealing and impurity redistribution. [0003] Among them, photolithography technology is similar to photo printing technology, and photoresist is similar to photosensitive material on silicon wafers. Etching is the technique of transferring the pattern on the photoresist to the silicon wafer. The task of etching is to etch away the material on the upper layer of the silicon wafer that is not protected by the photoresist. [0004] Etching needs to set the etching time. The exposure rate required by customers is often different. The existing etching method is to first estimate an etching time based on past experience for etching, and then modify it ...

Claims

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Application Information

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IPC IPC(8): H01L21/00
Inventor 牟睿石小兵
Owner SEMICON MFG INT (SHANGHAI) CORP
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