Wax for micro-electronic product and method of producing the same
A technology of microelectronics and products, applied in the direction of wax adhesives, etc., can solve the problems of insufficient melting of various components, great influence on the quality of finished wax, and the decline of the overall adhesive performance of the wax, so as to maintain health and stickiness Good, easy to use and transport results
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0020] Embodiment 1: Prepare 100KG of low-temperature wax.
[0021] In the thousand-level ultra-clean factory building, a high-temperature heating furnace (heating range of 800°C) is installed, a mixing and stirring tank is installed above the high-temperature heating furnace, and exhaust equipment is installed on the entire heating equipment and stirring equipment.
[0022] Brazilian wax 40KG, rosin 15KG, yellow beeswax 15KG, kanaba wax 10KG, microcrystalline wax 20KG that take by weighing are standby.
[0023] Step 1: Clean the mixing tank and rinse it with deionized water, then dry it with hot air at 60°C;
[0024] Step 2: Turn on the high-temperature heating furnace under the mixing tank, control the temperature at 100°C, and turn on the ventilation equipment at the same time.
[0025] Step 3: When the temperature in the mixing tank rises to 100°C, add Brazilian wax, and at the same time turn on the agitator and stir for about five minutes.
[0026] Step 4: When the Braz...
Embodiment 2
[0031] Take the low-temperature wax prepared in the above-mentioned examples and use it in the silicon wafer polishing process, apply the low-temperature wax evenly on the polishing disc, and test the microelectronic products after processing. The silicon wafer does not shift, which meets the standards in this industry. The offset is less than 0.001 mm; the surface flatness (TTV) of the silicon wafer is 0.0005 microns, which meets the requirements of the industry standard for the surface flatness to be less than 0.0009 microns. Experiments fully prove that the quality of the low-temperature wax prepared by the invention is better than that of similar products.
Embodiment 3
[0033] The low-temperature wax prepared by the present invention is compared with the softening test of the existing Japanese NSK-1008 product. According to industry standards, the low-temperature wax of the present invention can fully melt when it reaches 40°C. (It is the softening standard point in the industry, indicating the softening degree of product preheating), not fully melted, only 90% of the wax is melted, and the rest of the wax remains solid.
PUM
Property | Measurement | Unit |
---|---|---|
surface smoothness | aaaaa | aaaaa |
surface | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com