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Wax for micro-electronic product and method of producing the same

A technology of microelectronics and products, applied in the direction of wax adhesives, etc., can solve the problems of insufficient melting of various components, great influence on the quality of finished wax, and the decline of the overall adhesive performance of the wax, so as to maintain health and stickiness Good, easy to use and transport results

Inactive Publication Date: 2009-02-18
JIANGSU HAIXUN IND GROUP SHARE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing defects of low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax used in the surface processing of microelectronic products include that due to the high content of impurities, and the manual mixing of various components cannot be fully stirred and mixed, resulting in wax The overall adhesive performance of the wax decreases, and the problem of uneven and uneven application and adhesion occurs in the production process; the preparation of the low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax uses artificial control of temperature and stirring, and the operating conditions exist Errors have a great impact on the quality of the finished wax, for example: uneven stirring will cause insufficient melting of various components; inaccurate temperature control, if it is too high, it will cause the wax to be coked, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment 1: Prepare 100KG of low-temperature wax.

[0021] In the thousand-level ultra-clean factory building, a high-temperature heating furnace (heating range of 800°C) is installed, a mixing and stirring tank is installed above the high-temperature heating furnace, and exhaust equipment is installed on the entire heating equipment and stirring equipment.

[0022] Brazilian wax 40KG, rosin 15KG, yellow beeswax 15KG, kanaba wax 10KG, microcrystalline wax 20KG that take by weighing are standby.

[0023] Step 1: Clean the mixing tank and rinse it with deionized water, then dry it with hot air at 60°C;

[0024] Step 2: Turn on the high-temperature heating furnace under the mixing tank, control the temperature at 100°C, and turn on the ventilation equipment at the same time.

[0025] Step 3: When the temperature in the mixing tank rises to 100°C, add Brazilian wax, and at the same time turn on the agitator and stir for about five minutes.

[0026] Step 4: When the Braz...

Embodiment 2

[0031] Take the low-temperature wax prepared in the above-mentioned examples and use it in the silicon wafer polishing process, apply the low-temperature wax evenly on the polishing disc, and test the microelectronic products after processing. The silicon wafer does not shift, which meets the standards in this industry. The offset is less than 0.001 mm; the surface flatness (TTV) of the silicon wafer is 0.0005 microns, which meets the requirements of the industry standard for the surface flatness to be less than 0.0009 microns. Experiments fully prove that the quality of the low-temperature wax prepared by the invention is better than that of similar products.

Embodiment 3

[0033] The low-temperature wax prepared by the present invention is compared with the softening test of the existing Japanese NSK-1008 product. According to industry standards, the low-temperature wax of the present invention can fully melt when it reaches 40°C. (It is the softening standard point in the industry, indicating the softening degree of product preheating), not fully melted, only 90% of the wax is melted, and the rest of the wax remains solid.

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Abstract

The invention provides wax used for microelectronic products, and a preparation method thereof; the wax comprises the following components: Brazil wax, rosin, cera flava, Carnanba wax and microcrystal wax, wherein, the weight percent of Brazil wax is 30 percent to 40 percent, the weight percent of rosin is 10 percent to 15 percent, the weight percent of cera flava is 10 percent to 15 percent, the weight percent of Carnanba wax is 10 percent to 15 percent, and the rest is microcrystal wax; the wax is prepared with non-toxic environment protective raw materials, is good for maintaining the health of production operators and not inflammable, has good safety, and is convenient to be used and transported; during the production process, the automatic control and adjustment of temperature raising and stirring improves the product stability, consistency and reliability; the wax is produced in Class 1000 clean production environment, which prevents introducing foreign pollutants, dust, particles and the like during processing, effectively improves product purity and ensuring the surface polishing quality of the microelectronic products.

Description

technical field [0001] The invention relates to industrial waxes, in particular to a wax for microelectronic products which can be used for bonding when processing microelectronic products and a preparation method thereof. Background technique [0002] When polishing the surface of microelectronic components, it is necessary to evenly coat a thin layer of wax between the product to be polished and the polishing disc, and use the adhesiveness of the wax to firmly make the product to be polished on the polishing pad. Therefore, low-temperature wax plays a decisive role in the surface processing quality of microelectronic products. [0003] The existing defects of low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax used in the surface processing of microelectronic products include that due to the high content of impurities, and the manual mixing of various components cannot be fully stirred and mixed, resulting in wax The overall adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L91/06C09J191/06
Inventor 仲跻和
Owner JIANGSU HAIXUN IND GROUP SHARE
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