Adhesive encapsulating composition film and organic electroluminescence device

A technology of adhesive films and adhesives, applied in the direction of film/sheet adhesives, adhesives, luminescent materials, etc., which can solve problems such as deterioration

Inactive Publication Date: 2009-02-18
3M INNOVATIVE PROPERTIES CO
View PDF8 Cites 53 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even when the above-mentioned drying method is used, moisture permeated into the container from...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive encapsulating composition film and organic electroluminescence device
  • Adhesive encapsulating composition film and organic electroluminescence device
  • Adhesive encapsulating composition film and organic electroluminescence device

Examples

Experimental program
Comparison scheme
Effect test

example

[0110] The present invention is described below by referring to Examples, but the present invention is of course not limited to these Examples.

example 1

[0111] Example 1 : Production of adhesive packaging films

[0112] 15 parts by weight of polyisobutylene resin (OPANOLB100 from BASF AG, having a viscosity average molecular weight of 1,110,000 g / mol) and 10 parts by weight of hydrogenated petroleum resin (IMARV P-100 from Idemitsu Kosan Co., Ltd., softening point: 100° C.) was dissolved in toluene to prepare a 15% by weight resin solution. The resulting resin solution was coated on a 38 μm thick release-treated PET film and dried in an oven at 100° C. for 20 minutes. The resulting film containing the pressure-sensitive adhesive was laminated on a 25 μm thick release-treated PET (polyethylene terephthalate) film to produce a pressure-sensitive adhesive sheet. In this way, a transparent film (adhesive packaging film) having a pressure-sensitive adhesive thickness of 50 μm was obtained. The properties of the obtained packaging film were evaluated by adhesion test, moisture permeability measurement and visible light transmittan...

example 16

[0147] Example 16 : Production of organic EL devices

[0148] In this example, a Figure 4 The organic EL device 10 of the layer structure. As the glass substrate, a film 2 containing ITO (indium tin oxide) (manufactured by Sanyo Vacuum Industry Co., Ltd., ITO film thickness: 150 nm, film resistance: <14 Ω / square, glass thickness: 0.7 mm, peripheral dimension: 40 mm was prepared. ×40mm) glass substrate 1. The ITO film 2 was patterned with photolithography to form an ITO electrode pattern 2 on the substrate 1 .

[0149] The surface of the substrate 1 with the patterned ITO electrodes is rinsed with solvent washing. Thereafter, the organic light-emitting layer 3 and the metal electrode layer 4 are then film-formed on the ITO electrode 2 by vacuum vapor deposition to form a stacked body 5 . During the vacuum vapor deposition, the vapor deposition rate and the vapor deposition thickness were monitored by using a quartz oscillator (IC6000, manufactured by INFICON) film thickn...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Softening pointaaaaaaaaaa
Softening pointaaaaaaaaaa
Softening pointaaaaaaaaaa
Login to view more

Abstract

An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority from Japanese Patent Application no. 2006-15334 filed on January 24, 2006, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present invention discloses encapsulating or sealing compositions with adhesive properties for use in electronic devices. More specifically, the present invention discloses an adhesive encapsulating composition and an encapsulating film that can be used as an encapsulant for a display device such as an organic electroluminescent device. Background technique [0004] An organic electroluminescent (hereinafter referred to as "EL") device includes an organic layer (hereinafter sometimes referred to as a "light emitting unit") formed by stacking an organic charge transport layer and an organic light emitting layer between an anode and a cathode. supply. EL devices typically provide high intensity...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J123/00C09J7/02C09J7/00C09J7/22C09J7/38
CPCY10T428/31917C09J123/22C09J7/0246C09J7/021C09J123/20C09J2423/00C09J2203/326C09J7/38C09J7/381C09J7/22C08L2666/02C08L2666/06C09J2301/416C09K11/00C09J123/00
Inventor 藤田淳山崎崇南秀树小堀奈未
Owner 3M INNOVATIVE PROPERTIES CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products