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Lead-free solder alloy

A technology of lead-free alloys and solders, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as unsatisfactory, achieve the effect of inhibiting the generation of oxides and reducing the amount of addition

Active Publication Date: 2009-03-11
株式会社日本菲拉美达陆兹
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] Therefore, the current SnCu-based alloy solder is completely unsatisfactory from the viewpoint of not being able to satisfy all the properties required for practical use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0041] 4 kg of solders of Examples (No1-No2) and Comparative Examples (No1-No4) having the composition of Table 1 described later were produced. In addition, Sn0.7Cu0.04Co (Example 1) means that Cu is 0.7% by weight, Co is 0.04% by weight, and the remainder is an alloy solder of Sn.

[0042] The obtained solder was measured for its solidus temperature / liquidus temperature (°C), creep strength (150°C, 3kgf), zero-crossing time (Zerocrosstime) (sec), amount of Cu elution (260°C, 30 minutes), The presence or absence of scum formation. The results are shown in Table 1 below. In addition, the measurement method was performed as follows.

[0043] [Solid phase temperature / Liquid phase temperature (°C)]

[0044] Using 500 g of solder, the melting point [solidus temperature / liquidus temperature (° C.)] was measured by the cooling method.

[0045] [creep strength]

[0046] Insert a φ0.8mm tinned copper wire into a 30mm×30mm×1.6mm glass fiber epoxy substrate with a φ3.0mm copper cir...

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Abstract

An SnCu-based lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including horning. It satisfies all of the properties required for practical use. The solder alloy contains 0.1-1.5 wt.% copper, 0.01-0.05 wt.%, excluding 0.05 wt.%, cobalt, 0.05-0.5 wt.% silver, and 0.01-0.1 wt.% antimony, the remainder being tin, and optionally further contains 0.001-0.008 wt.% germanium. The alloy prevents dross formation and eliminates the drawback that soldering defects including horning occur.

Description

technical field [0001] The present invention relates to lead-free alloy solders used for metal joining of electric and electronic equipment, etc., and relates to SnCu-based lead-free alloy solders used for fluid soldering or manual soldering, etc., if described in more detail. Background technique [0002] Currently, alloy solders containing lead, such as 63% by weight of Sn and 37% by weight of Pb, are generally used as alloy solders used for metal bonding of electric and electronic devices. [0003] It has been pointed out that when lead leached from waste such as substrates with solder permeates into ground water in lead-containing solder, drinking the ground water can cause serious damage to the nervous system. Accordingly, many lead-free alloy solders that do not contain lead are being investigated. [0004] As lead-free alloy solders that do not contain lead, alloy solders in which Bi, In, or the like are added to SnCu-based alloys, SnAgCu-based alloys, SnZn alloys, o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00
CPCB23K35/262C22C13/00
Inventor 山田清二杉森健一郎
Owner 株式会社日本菲拉美达陆兹