Four-element heat radiator

Abstract

The invention discloses a four-element heat radiator for radiating the heat of a semiconductor thermoelectric device, which is characterized in that a working substance heat pump is made form materials with poorer heat-conducting property; and when the four-element heat radiator works under the condition of power failure or low power, liquid working substances in the working substance heat pump is siphoned into a gap of a siphon fin; a structure separation cavity is formed between the siphon fin and a motherboard so that the working substance heat pump becomes a heat insulating apparatus; when the four-element heat radiator works at the power of more than 60 percent of the rated power, large area of the liquid working substances in the working substance heat pump are heated to boil, and the boiling working substances containing latent heat cause the structure separation cavity to no longer exist while increasing the steam pressure rapidly to drive circular heat pipes to work, so that the working substance heat pump is turned into an extra good heat conduction path which can absorb the high-power heat with high heat flow density so as to realize a structure of secondary heat insulation and extra good heat transfer and radiation; therefore, the temperature difference of a heat insulation system and the environment is more than or equal to 40 DEG C, so that the semiconductor refrigeration becomes an energy saving refrigeration mode and can keep the temperature for more than 10 hours with a self-contained battery, and can be widely applied to moving refrigerators.

Description

Technical field [0001] The invention relates to a heat sink for dissipating heat from a semiconductor thermoelectric device, especially a heat sink capable of rapidly dissipating heat with high heat flux density and high power and capable of secondary heat insulation, including four elements: cooling fins, circulating heat pipes, working medium heat pumps, and a motherboard Consists of four elements radiator. Background technique [0002] At present, the radiators used in the known semiconductor refrigeration are all made of copper or aluminum good heat conductors. When the semiconductor thermoelectric device works under the excellent radiator, the thermoelectric conversion process has a quadratic relationship, because The area of ​​the hot and cold surfaces of semiconductor thermoelectric devices is fixed. With the increase of power supply and the decrease of the temperature of the cold surface, the heat generated by the hot surface is divided into two stages. The temperat...

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Problems solved by technology

[0003] In order to overcome the above-mentioned shortcomings, the present invention aims at the disadvantages of the existing semiconductor refrigeration, which consumes a lot of power and cannot be powered off to keep warm, and provides a radiator composed of four elements: cooling fins, circulating heat pipes, working fluid heat pumps, and motherboards. Radiating fins, circulating heat pipes, and motherboards are made of copper or aluminum good thermal conductors, and the working medium heat pump is made of carbon steel or stainless steel with poor thermal conductivity or a combination of poor thermal conductors and good thermal conductor materials, that is, the solution In a radiator that is not completely composed of good heat conductors, when the power supply needs to quickly dissipate high heat flux and high-power heat, the working medium heat pump receives heat to work, and the internal working medium boils to promote the rapid circulation of the working medium in the circulating heat pipe , dissipate heat outward through the cooling fins, solve the structure of high-speed heat transfer, when the power outage requires heat preservation, the working medium heat pump stops working, the internal working medium stops boiling, and the working medium is siphoned in the siphon fins to form a structural compartment , coupled with the poor thermal conductivity of its own materials, the working fluid heat pump has become a device that hinders the semiconductor thermoelectric device from using the temperature difference to perform the reverse effect. , on this basis, the semiconductor thermoelectric device works at a low power below 15% of the rated power, which can make the cold and hot surface of the semiconductor thermoelectric device ΔT≤30°C, and there is only low-power heat on the hot surface, which is not enough to make The working fluid in the working fluid heat pump boils, and there is still a structural compartment in the working fluid heat pump. Therefore, the heat conduction channel is transformed into an active heat insulation barrier at the core of the semiconductor thermoelectric device, thereby realizing two High-level heat insulation can greatly reduce the power consumption to maintain the temperature difference and ensure the cooling temperature. Therefore, when there is no external power supply, it can not only keep the power off for a long time, but also provide small power by its own battery. On the one hand, it can actively keep warm, on the other hand, it can greatly extend the battery life, and achieve the purpose of being easy to use in vehicles

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