Conductive powder plated by electroless plating and process for producing the same

A non-electrolytic plating, conductive technology, applied in the direction of liquid chemical plating, superimposed layer plating, coating, etc., can solve the problems such as difficult to connect with fine pitch, difficult to obtain adhesive products, etc.

Active Publication Date: 2009-04-22
NIPPON CHECMICAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the method described in Patent Document 1, especially fine particles with an average particle diameter of 20 μm or less are plated, it is difficult to obtain a product with excellent adhesion, and it is difficult to use it for applications such as fine-pitch connections.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0057] (1) Melamine resin covering process

[0058] In a four-necked flask equipped with a cooler, add 100 parts by weight of the core material powder shown in Table 1, 100 parts by weight of water, 3 parts by weight of melamine, and 8 parts by weight of 37% formaldehyde solution, and add 5% Aqueous sodium carbonate solution, adjust the pH to 9.0. Then the temperature was raised to 75°C and stirred for 2 hours to carry out the reaction. After the reaction, it was cooled, filtered, washed with water, dried at 150° C. for 6 hours under reduced pressure (below 5 mmHg) and hardened to obtain a core material powder covered with 2.1% by weight of melamine resin.

[0059] (2) Catalytic treatment process

[0060] 200 ml of an aqueous tin chloride solution was added to 200 ml of an aqueous slurry containing 7.5% by weight of the melamine-covered core material powder obtained in step (1). The concentration of the aqueous solution is 5×10 -3mol / L. Stir at room temperature for 5 minu...

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PUM

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Abstract

Provided is a conductive powder plated by electroless plating which, even when composed of fine particles having an average particle diameter of, in particular, 20 mu m or smaller, has excellent deposit adhesion imparted thereto without using chromic acid, which is causative of environmental pollution, permanganic acid, etc. and a process for industrially advantageously producing the powder. The conductive powder plated by electroless plating is characterized by comprising a core powder coated with a melamine resin and a metallic coating film deposited thereon by electroless plating.The process is characterized by comprising: a step in which a core powder is brought into contact with an initial condensate for a melamine resin and the initial condensate is polymerized to obtain a core powder coated with a melamine resin; a step in which a noble metal is deposited on the surface of the core powder coated with the melamine resin; and a step in which the core powder having the noble metal deposited thereon is plated by electroless plating.

Description

technical field [0001] The present invention relates to conductive electroless plating powder and its manufacturing method. Background technique [0002] In the past, in the case of manufacturing electroless plating products represented by conductive electroless plating powder, when the object to be plated is hydrophobic, it is necessary to perform a hydrophilic treatment on the surface to improve the metal film and the plated surface. The tightness of the object. As means for improving adhesion, conventionally, strong oxidizing agents such as chromic acid or permanganic acid have been used. [0003] However, these oxidizing agents have a large environmental load and are not suitable for use. If proper reduction and cleaning treatment is carried out, the residue of chromium or manganese in the plated product will become less, and it is very difficult to completely remove it. [0004] Therefore, as a hydrophilization treatment method with a small environmental load, for ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31C23C18/18C23C28/00
CPCC23C28/00C23C18/31C23C28/02C23C18/18C23C18/1635C23C18/30C23C18/34C23C18/54
Inventor 小山田雅明阿部康弘
Owner NIPPON CHECMICAL IND CO LTD
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