Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for plating metal on surface of insulating base material

A technology of insulating substrate and electroplating metal, which is applied in electrical components, printed circuits, printed circuit manufacturing, etc., and can solve the problems of affecting the conductivity and stability of circuit boards, weak conductivity of organic conductive polymers, and poor response.

Inactive Publication Date: 2018-09-28
GUANGDONG GUANGHUA SCI TECH +1
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this process also has an Achilles' heel. Due to the charge characteristics of the treated substrate surface (such as the hole wall), if the substrate is directly treated with a permanganate-containing solution, the secondary particles deposited on the substrate surface, especially the hole wall surface The amount of manganese oxide will be very small, so that the organic conductive film formed on the surface of the substrate will be relatively thin, and the conductivity of the organic conductive polymer is weak, especially in the glass fiber site in the hole of the circuit board. The generation of voids, commonly known as "broken copper", will appear light transmission and voids in the backlight test
In addition, even if no light transmission and voids are produced in the backlight test, if the copper thickness in a certain position in the hole is extremely thin, it will still affect the conductivity and stability of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]Substrate surface modification: Take two 1.6mm thick polytetrafluoroethylene resin substrates, use an alloy drill to drill through holes with a diameter of 0.2mm on them, and use a laser to produce blind holes with a dielectric thickness of 75 μm and a diameter of 100 μm, and perform the following respectively The same treatment: wash with water first, then immerse in 8g / L polyvinylsulfonic acid (polyanion) aqueous solution at 50°C for about 1 minute, after washing, immerse in 4g / L polyacrylamide (polyacrylamide) at the same temperature Polycation) and 4g / L polyethyleneimine (polycation) mixed aqueous solution for about 1 minute, repeat the above polycation and polyanion treatment 7 times, after washing with water, immerse in 50g / L at 80°C, pH =6 (adjusted with 10g / L boric acid) in an aqueous potassium permanganate solution for about 1.5 minutes, washed with water after the treatment, and set aside.

[0035] Manganese dioxide adsorption test: get one of the processed sub...

Embodiment 2

[0038] Substrate surface modification: take two 1.6mm thick epoxy resin substrates, use an alloy drill to drill through holes with a diameter of 0.2mm on them, and use a laser to generate blind holes with a medium thickness of 75 μm and a diameter of 100 μm, and perform the same treatment as follows : Wash with water first, then immerse in 4g / L polyethyleneimine (polycation) aqueous solution at 15°C for about 1 minute, after washing with water, immerse in 4g / L polystyrenesulfonic acid ( Polyanion) mixed aqueous solution for about 1 minute, repeat the above polycation and polyanion treatment once, after washing with water, immerse in 50g / L at 80°C, pH=6 (adjust with 10g / L boric acid) Treat in potassium permanganate aqueous solution for about 1.5 minutes, wash with water after treatment, and set aside.

[0039] Manganese dioxide adsorption test: get one of the processed substrates, use a sufficient amount of 3% (volume fraction) sulfuric acid and 3% (volume fraction) hydrogen pe...

Embodiment 3

[0042] Substrate surface modification: Take two pieces of glass fiber cloth with a thickness of 1.6mm, drill a through hole with a diameter of 0.2mm on it with an alloy drill bit, and use a laser to generate a blind hole with a medium thickness of 75 μm and a diameter of 100 μm, and perform the same treatment as follows: First wash with water, then immerse in 4g / L polyethyleneimine (polycation) aqueous solution at 35°C for about 1 minute, after washing with water, immerse in 4g / L polystyrenesulfonic acid (polyethylene sulfonic acid) at the same temperature Anion) aqueous solution for about 1 minute, repeat the above polycation and polyanion treatment twice, after washing with water, immerse in 50g / L at 80°C, pH=6 (adjust with 10g / L boric acid) permanganese Potassium acid aqueous solution for about 1.5 minutes, after the treatment is completed, washed with water and set aside.

[0043] Manganese dioxide adsorption test: use the same method as in Example 1 to process one of the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
concentrationaaaaaaaaaa
adsorption capacityaaaaaaaaaa
adsorption capacityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for plating a metal on the surface of an insulating base material. The method comprises the following steps: alternately touching the surface of the insulating base material with polycations and polyanions to produce a modified surface; touching the modified surface with an aqueous solution containing permanganate ions to form a manganese dioxide adsorption layeron the modified surface; forming a conductive polymer layer on the surface of the manganese dioxide adsorption layer; and performing plating on the surface of the conductive polymer layer to form a metal layer. According to the method, by means of the alternate deposition of the polycations and polyanions on the surface of the insulating base material to form a firmly combined coating layer withthe surface of the base material, after a thin film with a certain thickness is uniformly formed on the surface by means of the modification and adsorption, under the same metal plating solution and plating conditions, the deep plating ability and the dispersing ability of the plating solution are greatly improved, the obtained metal plating layer has the characteristics of flatness, uniformity and good backlight effect, and the phenomena of hole breakage and that the Plating metal layer at a certain site in the hole is too thin are avoided.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a method for electroplating metal on the surface of an insulating substrate. Background technique [0002] With the rapid development of the electronic information industry, the printed circuit board (Printed Circuit Board, PCB) industry, which is the carrier of electronic interconnection, is also developing rapidly. From the previous double-sided multilayer to high-density interconnect board HDI (HighDensity Interconnector), and now to the current substrate-like SLCB (Substratelike-PCB), the process requirements are getting higher and higher. In the past, formaldehyde was used as a reducing agent for the electroless copper plating of interlayer conduction in this process. Formaldehyde is a highly toxic carcinogen, which poses a great threat to the health of operators. In addition, metal ions such as copper ions, nickel ions, and palladium ions are used and discharged ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18C25D5/54C25D5/56
CPCC25D5/54C25D5/56H05K3/188
Inventor 苏朝晖张光宇刘彬云肖亮何雄斌万会勇王翀
Owner GUANGDONG GUANGHUA SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com