Method for preparing metal membrane on porous matrix by chemical plating

A porous substrate and electroless plating technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of uneven metal deposition speed and affecting the quality of the final coating, so as to improve the coating quality and yield Effect

Active Publication Date: 2009-04-29
RISON HI TECH MATERIALS CO LTD
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  • Abstract
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Problems solved by technology

[0004] The purpose of the present invention is to propose a method for preparing a metal film by electroless plating on a porous substrate in order to impr

Method used

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  • Method for preparing metal membrane on porous matrix by chemical plating
  • Method for preparing metal membrane on porous matrix by chemical plating

Examples

Experimental program
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Effect test

Embodiment 1

[0018] Embodiment 1. Electroless silver plating

[0019] (1) The substrate is a porous ceramic tube provided by Nanjing Jiusi High-tech Co., Ltd., with an average pore diameter of 0.2 μm, an outer diameter of 1.25 cm, an inner diameter of 0.7 cm, and a length of 5 cm. Wash with commercial dish soap solution, tap water, deionized water.

[0020] (2) Sensitization and activation of the matrix. Sensitizer contains SnCl 2 : 5g / L, concentrated hydrochloric acid (37%): 1ml / L; the activation solution contains PdCl 2 : 0.2g / L, concentrated hydrochloric acid: 1ml / L. The substrate is alternately dipped in the sensitizing solution and the activation solution, and rinsed with water after each dipping; the sensitization-activation step is repeated 5 times, and the surface of the substrate is dark brown.

[0021] (3) Substrate preheating. Put the activated ceramic tube into 90°C water and heat it for 10 min.

[0022] (4) Electroless silver plating. The preheated substrate is quickly ...

Embodiment 2

[0024] Embodiment 2. electroless palladium plating

[0025] (1) With the step (1), (2) of embodiment 1.

[0026] (2) Same as step (3) of Example 1, but the preheating temperature is 70° C. and the time is 5 minutes.

[0027] (3) with the step (4) of embodiment 1, but plating solution is changed into palladium plating solution, and its composition is PdCl 2 : 5g / L, concentrated ammonia water: 250ml / L, Na 2 EDTA: 70g / L. The electroless plating temperature is 30°C, heated in a water bath.

[0028] (4) With the step (5) of embodiment 1.

Embodiment 3

[0029] Embodiment 3. electroless palladium plating

[0030] (1) With the step (1), (2) of embodiment 1. However, the substrate is porous stainless steel, and its surface contains ZrO with a thickness of about 100 μm. 2 coating with an average pore size of 0.5 μm. The substrate is 10 μm in length, 10 mm in outer diameter, and 6 mm in inner diameter.

[0031] (2) Same as step (3) of Example 1, but the preheating temperature is 70° C., and the time is 15 minutes.

[0032] (3) With the step (3), (4) of embodiment 2.

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Abstract

The invention relates to a method for chemically plating a metal film on a porous matrix, that is, before the chemical plating, an activated matrix is preheated in hot water, and the preheating temperature is higher than the normal temperature of the chemical plating. The chemical plating can be initiated quickly as soon as the hot matrix contacts a plating solution, so that an even and continuous metal film is formed on the surface of the matrix to lay a good foundation for the growth of subsequent films. The method effectively avoids the problems of uneven plating coats or even alopecia areata, and improves the adhesive force of the metal film.

Description

technical field [0001] The invention relates to a method for chemically plating a metal film on a porous substrate to solve the problem that the uneven metal deposition speed on the surface of the substrate in the initial stage of electroless plating affects the quality of the final coating. Background technique [0002] Metal films based on porous materials are widely used in the fields of gas separation, electrochemistry, and electronics. The film-making methods include electroless plating, electroplating, physical vapor deposition, chemical vapor deposition, thermal spraying, etc. The electroplating method is only suitable for conductive substrate materials and is limited by the shape of the substrate; although the vapor phase deposition method has been reported in large numbers, it has high cost and low metal deposition efficiency, and is only suitable for preparing very thin metal films, and has a great impact on the pore size and The surface finish is very demanding; t...

Claims

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Application Information

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IPC IPC(8): C23C18/31
Inventor 黄彦帅菁
Owner RISON HI TECH MATERIALS CO LTD
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