Method and system for measuring surface appearance of micro-device under transparent encapsulation medium
A technology for surface topography measurement and surface topography, applied in measurement devices, instruments, optical devices, etc., can solve the problems of interference fringe contrast reduction, surface topography deviation, affecting measurement accuracy, etc., to improve flexibility, The effect of small, precise surface topography measurements
Inactive Publication Date: 2009-05-20
TIANJIN UNIV
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However, the key to microscopic interferometry surface topography is the distribution of the optical path difference between the measurement beam and the reference beam, and the insertion of a transparent packaging medium will bring about changes in the distribution of the optical path difference, resulting in certain differences in the measured surface topography. In addition, the transparent packaging medium will cause the change of the optical path length, which will lead to a decrease in the contrast of the interference fringes in the interference image, thereby affecting the accuracy of the measurement, and may even cause the interference fringes to disappear, and the measurement cannot be performed at this time
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[0029] The block diagram of the surface topography measurement system of the micro-device under the transparent packaging medium is as follows: figure 1As shown, the system includes LED point light source or laser light source, beam expander collimating lens group, diaphragm, beam splitting prism, measuring objective lens, reference objective lens, plane reference mirror, optical path compensation plate, nanopositioner (PI S303, displacement resolution better than 1nm), nanopositioner controller (PI 624), digital camera (CV-M4+CL, 10bits, 1392×1040), optical imaging lens, digital image acquisition card (Dalsa, X64-CLiPro100), 3D Electrically controlled stage, data processing and control computer. LED point light source or laser light source, beam expander collimating lens group, diaphragm, beam splitting prism, measuring objective lens, reference objective lens, plane reference mirror, nanopositioner, nanopositioner controller constitute the Linniac phase shift micro-interfere...
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The invention discloses a system and a method for measuring surface topography of a micro structure under transparent encapsulating medium. The system comprises an LED point light source or laser light source, a beam enlarging collimating lens set, a diaphragm, a beam splitter prism, a measuring object lens, a reference object lens, a plane reference reflector, an optical path compensating plate, a nano orientator, a nano orientator controller, a digital video camera, an optical imaging lens, a digital image acquisition card, a three-dimensional electric control displacement platform, and a data processing and control computer. The measuring method comprises matching selection of the thickness of the compensation optical plate and compensation of the distribution of optical path difference between the measurement and reference optical paths. The system and the method have the advantages of obtaining interference image with good contrast by utilizing the characteristics of long working distance and splitting optical path structure possessed by the Linnik micro interference structure while measuring the micro structure under the transparent encapsulating medium and realizing the accurate measurement of the surface topography.
Description
technical field [0001] The invention relates to a surface profile measurement system and method of a micro-device under a transparent packaging medium, which belongs to the photoelectric non-contact method-oriented geometric quantity measurement technology for micro-electromechanical systems. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is developed on the basis of microelectronics technology. It is an integrated device or system composed of electronic and mechanical components. It is manufactured by a mass-processing process compatible with integrated circuits. At the same time, computing, sensing and execution are integrated, thus changing the way of perceiving and controlling the natural world. Most of the manufacturing processes of microelectromechanical systems (MEMS) are compatible with the processing technology in the field of microelectronics technology, but a considerable number of MEMS devices contain deformable or moving structures, which ...
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IPC IPC(8): G01B11/24
Inventor 胡晓东郭彤傅星胡小唐
Owner TIANJIN UNIV