Device for cleaning vanadium-removing copper wire balls

A cleaning device and copper wire technology are applied in transportation and packaging, cleaning methods and utensils, cleaning methods using liquids, etc., which can solve the problems of great harm to the human body and the environment, high labor intensity, and low efficiency, and achieve good cleaning quality , reduce labor intensity and high efficiency

Active Publication Date: 2009-06-03
仙桃市中星电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the existing technical problems such as high labor intensity, low efficiency, great harm to human body and environment, and non-environmental protection existing in the existing copper wire ball regeneration washing

Method used

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  • Device for cleaning vanadium-removing copper wire balls
  • Device for cleaning vanadium-removing copper wire balls
  • Device for cleaning vanadium-removing copper wire balls

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0013] Fig. 1 is a schematic structural view of a preferred embodiment of the present invention, figure 2 Is its A-A sectional view. combined by Figure 1 and figure 2 It can be seen that the vanadium-removing copper wire ball cleaning device is mainly composed of frame 20, pickling liquid storage tank 11, rough cleaning liquid storage tank 9, fine cleaning liquid storage tank 4, tunnel 3, copper wire ball conveying mechanism 2, nozzle group 5 , 8, 12 and so on.

[0014] The pickling liquid storage tank 11, the rough cleaning liquid storage tank 9, and the fine cleaning liquid storage tank 4 are fixed on the floor. These tanks can be directly used as a part of the frame to support the tunnel 3. The tunnel 3 is linear and adopts acid-resistant The PP board is welded and its cross section is rectangular.

[0015] From the entrance of the tunnel 3, on the inner wall of the top of the tunnel 3, a group of pickling nozzles 12, a group of rough cleaning nozzles 8, and a group of f...

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PUM

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Abstract

A device for cleaning vanadium-removing copper wire balls comprises a tunnel, a copper wire ball conveying mechanism which is arranged at the bottom of the tunnel and passes through the entire tunnel, and a suction tube which is arranged at the top of the tunnel and connected with a vacuum pump. An acid cleaning spray nozzle set, a rough cleaning spray nozzle set and a fine cleaning spray nozzle set are sequentially arranged on the inner wall of the tunnel from the inlet of the tunnel, and an acid cleaning liquid storage tank, a rough cleaning liquid storage tank and a fine cleaning liquid storage tank are sequentially arranged below the copper wire ball conveying mechanism in the positions corresponding to the spray nozzle sets. The acid cleaning spray nozzle set, the rough cleaning spray nozzle set and the fine cleaning spray nozzle set are all connected with a high-pressure hydraulic pump via pipelines, and the high-pressure hydraulic pump is correspondingly connected with acid cleaning liquid storage tank, the rough cleaning liquid storage tank and the fine cleaning liquid storage tank. The entire cleaning process is enclosed and mechanized; and during the cleaning process, no irritant gases are discharged and an operator does not directly contact the copper wire balls, so as not to affect the health of the operator.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a cleaning device for vanadium-removing copper balls used for removing vanadium from titanium tetrachloride. Background technique [0002] To remove vanadium from titanium tetrachloride, there are currently three methods for removing vanadium: copper wire ball, mineral oil and aluminum powder. Among them, the copper wire ball removes vanadium, which is to roll the copper wire into a copper wire ball and put it into the vanadium removal tower in layers, let the gas phase titanium tetrachloride continuously pass through the vanadium removal tower and contact the copper wire ball, so that the vanadium impurities are precipitated on the copper wire A means of vanadium removal on the surface, although the copper wire ball has a good effect of removing vanadium and can obtain high-quality titanium tetrachloride, but the copper wire ball removes vanadium is an intermittent operation. When the surfac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/08B65G25/08
Inventor 赵中友黄敏杨锋林贡王敏
Owner 仙桃市中星电子材料有限公司
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