Low loss multilayered circuit board
A multi-layer circuit board and circuit technology, which is applied to printed circuit components, measuring electricity, measuring electrical variables, etc., to achieve the effect of making good use of circuit space
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[0041] Hereinafter, several preferred embodiments are listed with reference to the accompanying drawings to describe the structure and functions of the present invention in detail.
[0042] Please refer to Figure 2 to Figure 4 A multi-layer circuit board 2 provided by the most preferred embodiment of the present invention shown is a multi-layer printed circuit board of approximate integrated circuit wafer size, which is used on the wafer test probe card, and can be used for a wide range of The wafer circuit assembly is used for electrical testing, and a plurality of signal circuits 30 and grounding circuits 40 with high-frequency transmission line characteristics are laid out on a plurality of substrates 20 with good insulation properties, and then these substrates 20 are laminated and laminated. , the multilayer circuit board 2 has a relative upper and lower surfaces 201, 202, the upper surface 201 is provided with a plurality of upper solder joints 203 near the periphery, an...
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Abstract
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