Thermally conductive thermoplastic adhesive composition

A composition and thermoplastic technology, applied in the direction of adhesive types, other rubber adhesives, polymer adhesive additives, etc., can solve the problems that cannot be said about heat resistance, sufficient retention, etc., and achieve excellent disassembly and high heat Conductivity, anti-static effect

Inactive Publication Date: 2009-06-10
HITACHI KASEI POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the lamination of the glass panel of the plasma display and the metal frame, after using a softener such as paraffin oil as proposed in the Japanese Patent Application Laid-Open No. In the case of a permanent sheet, there is a problem that since the thermally conductive material sheet contains a softener such as paraffin oil, it cannot be said that the heat-resistant holding force is sufficient.

Method used

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  • Thermally conductive thermoplastic adhesive composition
  • Thermally conductive thermoplastic adhesive composition
  • Thermally conductive thermoplastic adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] After preheating the heating kneader to 180°C, add 600 parts of KRAPRENE (trademark) LIR-290 (manufactured by Kuraray Co., Ltd., liquid hydrogenated polyisoprene rubber, weight average molecular weight 25,000, hydrogenation rate about 90%) as liquid rubber ), 200 parts of KRATON (trademark) G1650 (manufactured by KRATON Polymer Co., Ltd., SEBS, styrene / (ethylene·butylene) ratio = 29 / 71 mass ratio) as styrene rubber, 200 parts of Tackifying resin YS Polystar T145 (manufactured by YASUHARA CHEMICAL, terpene phenolic resin, softening point 145°C) and 10 parts of IRGANOX1010 (manufactured by Ciba Specialty Chemicals, hindered phenolic antioxidant) were mixed at 180°C for 4 hours, and each After the material was melted, 826 parts of E015 (manufactured by Chuetsu Graphite Industry Co., Ltd., artificial graphite, average particle diameter of about 135 μm and average aspect ratio of 3.4 as measured by laser diffraction method) were added as graphite, and further mixed at 180° C....

Embodiment 2

[0080] In addition to using 100 parts of KRATON (trademark) G1726 (manufactured by Kraton Polymer Co., Ltd., SEBS, styrene / (ethylene·butylene) ratio = 30 / 70 mass ratio, 70% diblock) as a styrene-based rubber, 300 Except for YS Polystar T145 as a tackifying resin, a thermally conductive thermoplastic adhesive composition having a graphite compounding amount of about 45% by mass was obtained in the same manner as in Example 1.

Embodiment 3

[0082] In addition to using UF-G30 (manufactured by Showa Denko Co., Ltd., artificial graphite, the average particle size measured by laser diffraction is about 10 μm, and the average aspect ratio is 3.6) as graphite instead of E015, the graphite compound was obtained in the same manner as in Example 2. A thermally conductive thermoplastic adhesive composition in an amount of about 45% by mass.

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Abstract

It is an object of the present invention to provide a thermally conductive thermoplastic pressure sensitive adhesive composition excellent in thermal conductivity, which can be used for lamination of a glass panel of a plasma display or a radiator plate of electronic devices etc., and can disassemble easily in product repair or after ending of life cycle. The present invention is a thermally conductive thermoplastic pressure sensitive adhesive composition characterized by having, as essential components: (A) liquid rubber; (B) at least either of styrene-based rubber and an amorphous olefin-based resin; (C) a tackifier resin; and (D) graphite, where formulation amount of graphite of the (D) component is in a range of from 30 to 75% by mass relative to total mass of the composition.

Description

technical field [0001] The present invention relates to a thermoplastic adhesive composition excellent in thermal conductivity for laminating a glass panel of a plasma display, a heat sink of an electronic device, etc., and more specifically relates to a product that can be easily disassembled when repairing or after the product life cycle ends thermally conductive thermoplastic adhesive composition. Background technique [0002] In recent years, parts such as glass panels of plasma displays, boards on which high-intensity LEDs are mounted, or high-performance CPUs may reach high temperatures, and electronic devices requiring heat dissipation by any method are increasing. [0003] In particular, in the case of a plasma display, when temperature unevenness occurs on the glass panel, color unevenness of the screen is also affected, and therefore, rapid heat dissipation is required. [0004] Generally, in the case of a plasma display, a method of bonding a glass panel and a me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J121/00C09J11/08C09J11/04C09J153/02
CPCC09J11/04C08K3/04C09J153/025C08L53/025C08L9/06C08L53/02C08C19/02C09J121/00C08L23/14C08L15/00C09J153/02C09J9/00C08L2666/02C08L2666/04
Inventor 长谷川胜朗岸本拓也
Owner HITACHI KASEI POLYMER CO LTD
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