Adhesive composition

A composition, pressure-sensitive adhesive technology, applied in the field of OED manufacturing, can solve the problems of unobtainable lamination performance, low reliability, low processability, etc.

Active Publication Date: 2017-05-31
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In Patent Document 1, an adhesive encapsulating composition film and an organic electroluminescence element are disclosed, the composition is a polyisobutylene (PIB) type pressure-sensitive adhesive, but it has low processing performance and lower reliability
Also, during lamination of large flat panels, air bubbles are trapped between the panels, so uniform lamination performance cannot be obtained

Method used

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  • Adhesive composition
  • Adhesive composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] Add 50 g of butyl rubber (Br068, EXXON) as a polymer derived from butene; 24 g of hydrogenated hydrocarbon resin (Eastotac H-100L) as a tackifier; 15 g of monofunctional acrylate, i.e., 2-(2- Ethoxyethoxy) ethyl acrylate as a compound of formula 1; 10 g of trimethylolpropane triacrylate as a polyfunctional active energy ray polymerizable compound; and 1 g of 2,2-dimethoxy-1 , 2-diphenylethan-1-one (Irgacure 651, Ciba) was used as a radical initiator, and the resulting mixture was diluted with toluene to a solid content of about 15 wt%, to prepare a coating solution.

[0113] The release surface of the peeled PET was coated with the prepared solution, and the coated product was dried in an oven at 100° C. for 15 minutes to obtain a pressure-sensitive adhesive layer with a thickness of 50 μm, which was combined with A copper film with a thickness of 20 μm is laminated to form an encapsulation film. Measure the film sample by 2J / cm 2 Physical properties of UV radiation e...

Embodiment 2

[0115] An encapsulating film was formed by the same method as described in Example 1 except that stearyl acrylate was used instead of the compound of Formula 1.

Embodiment 3

[0117] An encapsulating film was formed by the same method as described in Example 1 except that lauryl acrylate was used instead of the compound of Formula 1.

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Abstract

The present application relates to an adhesive composition, an encapsulation film comprising same, an organic electronic device comprising same, and a method for manufacturing the organic electronic device, and provides an adhesive composition that enables the formation of a structure that can effectively block moisture or oxygen from entering the organic electronic device from the outside, exhibits excellent processability during a panel manufacturing process, and at the same time, has excellent heat resistance maintaining force in a condition of high temperature and high humidity.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2015-0017620 filed with the Korean Intellectual Property Office on February 4, 2015, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present application relates to a pressure-sensitive adhesive composition, an encapsulation film comprising the composition, an organic electronic device (OED) comprising the encapsulation film, and a method of manufacturing an OED using the encapsulation film. Background technique [0004] An OED is a device including an organic material layer that uses holes and electrons to generate charge exchange, and the OED may be, for example, a photovoltaic device, a rectifier, a transmitter, or an organic light emitting diode (OLED). [0005] Among OEDs, OLEDs have lower power consumption and higher response speed than conventional light sources, and are advantageous for thinne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J4/02C09J4/06H01L51/52B32B7/12C09J7/28
CPCC09J7/28C09J7/22C09J7/38B32B7/12C09J4/06C09J7/385C09J7/255C09J2203/326C09J2301/302H10K50/80H10K50/844H10K71/00C08F255/10C09J151/04C09J7/10C09J2423/00C09J7/381Y02E10/549C09J2301/1242C09J2301/208C09J2301/312Y02P70/50H10K10/88C08F220/1812C09J2400/10C08K5/01C08K3/16C08K2003/3045C08K5/101C08K3/22C09J133/04C09J2301/40H10K30/88H10K50/84H10K50/846H10K85/141B32B15/085B32B15/20B32B37/1207C09J123/22C09J133/08B32B15/08B32B27/36B32B37/12B32B2307/302B32B2307/724B32B2457/206H01L23/28H01L23/3135
Inventor 柳贤智金贤硕文晶玉梁世雨
Owner LG CHEM LTD
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