Organosilane modified bisphenol A cyanate ester resin and preparation method thereof

A technology of organosilane and type cyanate, which is applied in the field of organosilane-modified bisphenol A type cyanate resin and its preparation, can solve problems that have not been seen, and achieve small molecular weight, excellent thermal performance, and dielectric constant Increased effect

Inactive Publication Date: 2009-06-17
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

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  • Organosilane modified bisphenol A cyanate ester resin and preparation method thereof

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Embodiment 1

[0025] Heat and melt 100 parts of bisphenol A type cyanate, then add 5 parts of γ-(2,3 glycidoxy)propyltrimethoxysilane, heat and stir, and carry out prepolymerization at 80-120°C. Polymerization time is 10-50 minutes. Then pour it into the preheated mold, vacuumize to remove air bubbles, put it into an oven to cure according to a certain curing process, the curing temperature is 100-220 ° C, and the curing time is 6-12 hours, that is, the organosilane modified Bisphenol A type cyanate resin.

Embodiment 2

[0027] Heat and melt 100 parts of bisphenol A cyanate, then add 5 parts of γ-aminopropyltriethoxysilane, heat and stir, and perform prepolymerization at 80-120°C for 10-50 minutes. Then pour it into the preheated mold, vacuumize to remove air bubbles, put it in an oven to cure according to a certain curing process, the curing temperature is 100-220 ° C, and the curing time is 6-12 hours, that is, the organic silane modified Bisphenol A type cyanate resin.

Embodiment 3

[0029] Heat and melt 100 parts of bisphenol A cyanate, then add 5 parts of N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, heat and stir, and prepolymerize at 80-120°C. The prepolymerization time is 10 to 50 minutes. Then pour it into the preheated mold, vacuumize to remove air bubbles, put it in an oven to cure according to a certain curing process, the curing temperature is 100-220 ° C, and the curing time is 6-12 hours, that is, the organic silane modified Bisphenol A type cyanate resin.

[0030] This patent uses organosilane to modify bisphenol A cyanate resin, and the active end groups such as epoxy groups and amino groups at the end of the organosilane chain react with the cyano group in the cyanate monomer to modify the bisphenol A cyanate resin. Introducing silicone segments. It can not only improve the compatibility between organosilane and cyanate resin, but also reduce the crosslinking density of cyanate resin, so that the modified system can improve its impact str...

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Abstract

The invention relates to organosilane modified bisphenol A-typed cyanate ester resin and a preparation method thereof, which have the technical characteristics that the following steps are included: heating and fusing the bisphenol A-typed cyanate ester monomer; adding organosilane to be heated and stirred; carrying out pre-polymerization, pouring the pre-polymer into a preheated mold; vacuumizing to remove bubbles; putting into an oven to be solidified based on certain solidification technology to obtain the organosilane modified bisphenol A-typed cyanate ester resin. Compared with the traditional ethylene rhodanate modification method, the method of the invention ensures the ethylene rhodanate modification system to have excellent mechanical performance, heat performance and dielectric performance owing to the fact that the organosilane is characterized by low molecular weight and good compatibility with the ethylene rhodanate resin. Furthermore, the modification system has favorable impact strength, bending strength and excellent heat resistance and dielectric performance, which can be used as the resin matrix of electronic encapsulating materials and wave-transparent composite materials.

Description

technical field [0001] The invention relates to an organosilane-modified bisphenol A cyanate resin and a preparation method thereof, which is a method for modifying bisphenol A cyanate resin with organosilane. Background technique [0002] Bisphenol A cyanate resin has the advantages of excellent mechanical properties, high heat resistance, and low water absorption. More importantly, it has excellent dielectric properties. It is the preferred resin matrix for a new generation of electronic packaging materials and wave-transparent composite materials. But like other thermosetting resins, this resin also has a weak point of being brittle. At present, there are many methods for toughening and modifying cyanate esters, mainly including copolymerization with thermosetting resins, blending with thermoplastics, blending with elastomers, etc., but these methods have their own shortcomings while toughening. Among them, the toughening effect of thermosetting resin modification is not...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/00C08K5/5415B29C39/00
Inventor 颜红侠梁国正李倩宋长文吴浩
Owner NORTHWESTERN POLYTECHNICAL UNIV
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