Manufacturing method for planar resistor printed board with thick metal plated on circuit surface
A technology of electroplating thick gold and planar resistors, which is applied in the manufacture of printed circuits, including printed electrical components, electrical components, etc., can solve the problems of bare copper, circuit graphics without any surface treatment, and non-exposed on the surface, etc., to achieve resistance High precision, superior loading stability, and impact current resistance
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[0028] A method for manufacturing a planar resistance printed board with thick gold plating on the surface of the circuit. The material for manufacturing the circuit board is an ARLONCLTE-XT board filled with a high-frequency material medium in the middle and coated with copper foil on both sides of the medium; at least one side of the material is copper foil and filled A layer of resistive film composed of metal alloy is embedded between the media, and the steps of manufacturing the board into a circuit board are as follows:
[0029] (1) Cutting: cutting the board according to the size of the production board;
[0030] (2) Drilling: Drill various functional holes on the cut sheet;
[0031] (3) Hole metallization: a thin layer of copper is deposited on the wall of the drilled hole by chemical deposition,
[0032] The thin copper layer deposited on the hole wall is thickened and protected by full plate electroplating;
[0033] (4) External light imaging: transfer the pre-desi...
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