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Manufacturing method for planar resistor printed board with thick metal plated on circuit surface

A technology of electroplating thick gold and planar resistors, which is applied in the manufacture of printed circuits, including printed electrical components, electrical components, etc., can solve the problems of bare copper, circuit graphics without any surface treatment, and non-exposed on the surface, etc., to achieve resistance High precision, superior loading stability, and impact current resistance

Inactive Publication Date: 2010-09-15
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the manufacturing method of the planar resistor printed circuit board is to etch the circuit pattern on the circuit board first, and then etch the copper on the resistor to expose the resistor. It can integrate various design features and different resistors. The circuit pattern of the value resistor is realized on the printed circuit board, but the printed circuit board produced by this process has the following blanks: 1. The resistance is embedded in the inner layer of the multilayer board instead of being exposed on the surface; 2. The circuit on the resistance layer The graphics do not have any surface treatment, it is bare copper

Method used

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Embodiment Construction

[0028] A method for manufacturing a planar resistance printed board with thick gold plating on the surface of the circuit. The material for manufacturing the circuit board is an ARLONCLTE-XT board filled with a high-frequency material medium in the middle and coated with copper foil on both sides of the medium; at least one side of the material is copper foil and filled A layer of resistive film composed of metal alloy is embedded between the media, and the steps of manufacturing the board into a circuit board are as follows:

[0029] (1) Cutting: cutting the board according to the size of the production board;

[0030] (2) Drilling: Drill various functional holes on the cut sheet;

[0031] (3) Hole metallization: a thin layer of copper is deposited on the wall of the drilled hole by chemical deposition,

[0032] The thin copper layer deposited on the hole wall is thickened and protected by full plate electroplating;

[0033] (4) External light imaging: transfer the pre-desi...

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PUM

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Abstract

The invention discloses a method for manufacturing a plane resistance printing board that electroplate thick golden on the circuit surface. The method includes steps as follows: firstly, etching a circuit figure, a resistance figure with an electroplate lead, using anti-electroplate wet film for covering the resistance figure and the electroplate lead, selective plating thick golden to the circuit and copper surface besides the resistance and lead for realizing aim of plating thick golden protective layer on the printing circuit surface circuit; secondly, using anti-electroplate wet film for covering the resistance figure and surrounding position before electroplating thick golden, then using master drawing for keeping the wet film of the resistance position by way of figure transmitting and ensuring precision of the resistance figure size after electroplating. The circuit board manufacture by the method has little resistance temperature coefficient in wide temperature range, little fixed capacitance inductor, low noise, high resistance precision, high heat dissipation, low electromotive force, excellent loading stability and withstanding impact current. The circuit board can be widely used in some advanced electronic product such as artificial satellite, radar, remote sensing, testing apparatus and instrument.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board (PCB), in particular to a method for manufacturing a planar resistance printed board with thick gold electroplated on the circuit surface. Background technique [0002] With the development of electronic products in the direction of lightness, thinness, small size and high reliability, in advanced electronic products such as satellites, radars, remote sensing, test instruments, meters, etc., the accuracy of resistance value, temperature coefficient of resistance and loading stability of resistors The requirements are getting higher and higher, and the traditional wirewound resistors and metal film resistors can no longer meet the requirements of high-end electronic products. In this context, planar resistor circuit boards emerged. In addition to the same stability and reliability as wirewound resistors, planar resistors also have the advantages of simple manufacturing process,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/16H05K3/20
Inventor 詹世敬许冬平关志锋
Owner GCI SCI & TECH