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Support board for perforation processing and method of perforation processing

A backing plate and substrate technology, which is applied in the field of perforation processing, can solve the problems of not being able to increase the number of printed wiring boards stacked, not being able to fully improve processing efficiency, and deteriorating the accuracy of perforation positions, achieving non-sticky and excellent anti-adhesion properties , Reduce drill bit breakage, excellent anti-adhesion effect

Inactive Publication Date: 2009-09-09
OHTOMO CHEM INS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet such requirements, if the backing plate is made of only an aluminum plate and a small-diameter drill with a diameter of 0.3mm or less is used for piercing, the drill will slide sideways on the backing plate surface, so there is a problem that the positional accuracy of the piercing will deteriorate. At the same time, a large number of drill breakages occur, and cracks occur on the inner peripheral surface of the hole, and the number of stacked sheets for printed wiring cannot be increased in order to suppress drill breakage, so the processing efficiency cannot be sufficiently improved.

Method used

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  • Support board for perforation processing and method of perforation processing
  • Support board for perforation processing and method of perforation processing
  • Support board for perforation processing and method of perforation processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] On one side of a substrate with a thickness of 100 μm formed by JIS A1N30-H18 material (this surface has been precoated), apply 100 parts by mass of polyethylene glycol with a number-average A mixed composition of aspartic acid was used to form a lubricating layer with a thickness of 30 μm, and a backing plate for punching was produced.

Embodiment 2～6

[0055] As a mixed composition, except having used the mixed composition which has the composition shown in Table 1, it carried out similarly to Example 1, and produced the backing board for punching processing.

[0056] In addition, the polyethylene glycol used in Examples 1, 2, 5, and 6, the polyoxyethylene laurate used in Example 3, and the polyethylene-polypropylene glycol used in Example 4 are all equivalent to "chosen One or more water-soluble resins selected from polyoxyethylene, polyoxyethylene-propylene copolymers, and their derivatives" water-soluble resin.

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Abstract

The present invention provides a support board for perforation processing (1) having lubrication layer (3) superimposed on at least one surface of aluminum substratum (2), characterized in that the lubrication layer (3) consists of a mixed composition containing a water-soluble resin and an amino acid. By this structuring, there can be provided a support board for perforation processing with a lubrication layer that excels in adherence to aluminum-made substratum, being free from stickiness and that excels in blocking prevention performance, ensuring easy washing after processing.

Description

technical field [0001] The present invention relates to a backer used when forming a small-diameter hole in a workpiece, for example, a through-hole on a printed wiring board, and a punching method using the backer. [0002] Furthermore, within the scope of the present description and patent claims, the word "aluminum" is used in the sense that it includes pure aluminum and aluminum alloys. Furthermore, within the scope of the present description and patent claims, the word "plate" is used in its sense including foils. Background technique [0003] Conventionally, when drilling through-holes on printed wiring boards, a method has been adopted in which a plurality of printed wiring boards are stacked on the mold base, and an aluminum backing plate is placed on the uppermost board. In this state, a drill is used to penetrate the backing plate from above to perforate the printed wiring sheet, and through-holes are formed in all the stacked sheets at once. This backing plate i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B26F1/16
CPCH05K3/0047B26F1/16H05K2203/127H05K2203/0786H05K2203/0214H05K2203/0152B26D7/088Y10T408/03Y10T408/567B23B41/00H05K3/00
Inventor 镝木新吾宇田能和大仓广治浦木康之沟达宽
Owner OHTOMO CHEM INS CORP
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