The utility model discloses a kind of elastic contact pads for
wafer transmission, by setting vertically movable adjusting
assembly and edge fixed,
contact layer structure of detachable middle part, the controllable switching of contact state between
contact layer and
wafer is realized, in
wafer transmission process, adjusting
assembly is in first position,
contact layer upper surface keeps plane and is completely contacted with wafer, can provide enough contact area and adsorption force, ensure that wafer does not slip, transmission is stable and reliable, after wafer transmission is in position, adjusting
assembly moves to second position and lifts the middle part of contact layer, so that contact layer upper surface is changed into umbrella-shaped arc surface, its edge and wafer gradually peel off, to greatly reduce contact area, realize the easy release of wafer, simple structure, easy to process and use, different wafer transmission working condition can be dynamically adapted, with excellent anti-slip and anti-adhesion comprehensive performance.