Support board for perforation processing and method of perforation processing
A backing plate and substrate technology, applied in the field of perforation processing, can solve the problems of not being able to increase the number of stacked sheets for printed wiring, not fully improving processing efficiency, and deteriorating the accuracy of perforation positions, achieving non-sticky and excellent anti-adhesion properties , Reduce drill bit breakage, excellent anti-adhesion effect
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Embodiment 1
[0061] On one side of a substrate with a thickness of 100 μm formed by JIS A1N30-H18 material (this surface has been precoated), 100 parts by mass of polyethylene glycol with a number average molecular weight of 10000 and 0.5 parts by mass of alkane are coated by roll coating. A mixed composition formed by substituting dibenzylidene sorbitol with base, thereby forming a lubricating layer with a thickness of 30 μm, was produced as a backing plate for punching.
Embodiment 2~7
[0063] As a mixed composition, except having used the mixed composition which has the composition shown in Table 1, it carried out similarly to Example 1, and produced the backing board for punching processing.
[0064] In addition, the polyethylene glycol used in Examples 1, 2, 5, 6, 7, the polyoxyethylene laurate used in Example 3, and the polyethylene-polypropylene glycol used in Example 4 are all equivalent to Water-soluble resin of "one or more water-soluble resins selected from polyoxyethylene, polyoxyethylene-propylene copolymers, and derivatives thereof".
[0065] In addition, in Example 7, "Pinklistar MK-1500" (trade name) manufactured by Arakawa Chemical Co., Ltd. was used as the rosin metal salt.
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