Adhesive tape and semiconductor device using the same

Abstract

In a chip-on-chip type semiconductor device, an adhesive tape electrically connects between a semiconductor chip (10) and a semiconductor chip (20). The adhesive tape contains; (A) a film forming resin of 10-50 wt%, (B) a thermosetting resin of 30-80 wt%, and (C) a curing agent of 1-20 wt% having flux activation characteristics.

Description

technical field [0001] The present invention relates to an adhesive tape and a semiconductor device manufactured using the adhesive tape. More specifically, the present invention relates to an adhesive tape used for electrical connection between semiconductor chips and an adhesive tape using the same in a chip on chip type semiconductor device capable of meeting the demand for higher density of semiconductor integrated circuits. Tape for the manufacture of semiconductor devices. Background technique [0002] In recent years, the development of high-density packaging technology for semiconductor integrated circuits has been actively developed in response to demands for higher functionality and miniaturization of electronic equipment. As one of such mounting techniques, there is a stacked chip type system-in-package (SiP) in which another semiconductor chip is flip-chip mounted on a semiconductor chip. This structure is attracting attention because it enables thinning of the...

AI Technical Summary

Problems solved by technology

[0005] However, these methods are difficult to ensure the reliability of the electrical connection between the semiconductor chips in the stacked chip type SiP and the ion migration resistance of the resin after sealing, and it is impossible to further increase the density of semiconductor integrated circuits

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