Method for melting nickel alloy by selective ink instead of dry film

Abstract

The invention discloses a method for melting a nickel alloy by a selective ink instead of a dry film, which comprises the following steps: (1) selectively coating ageing resistant nickel alloy ink on a circuit board by a screen printing technology to form a wet film; (2) drying the ink; (3) exposing the ink; (4) developing the wet film so as to expose the required copper surface; (5) performing nickel alloy melting on the circuit board; and (6) removing the wet film. The selective ink instead of the dry film is used for selective nickel alloy melting, so the cost is greatly reduced, and the combination effect of the wet film and the board surface is superior to the combination effect of the dry film and the board surface, unfavorable phenomena such as diffusion coating and the like can be effectively prevented, the defective rate of production is reduced and the quality of products is ensured. In addition, the method simplifies the manufacturing flow, saves the ink, greatly reduces the emission of pollutants, saves the expenses of wastewater treatment and is simultaneously favorable for the protection of ecological environment.

Description

technical field [0001] The invention designs the field of circuit board manufacture, and particularly relates to a method for performing nickel-gold plating with selective ink instead of dry film. Background technique [0002] In today's society, digital electronic products such as mobile phones are developing rapidly, and are developing in the direction of lightness, thinness, shortness, and smallness. The requirements for the integration of electronic components formed by them are also getting higher and higher. In order to meet this requirement, circuit board manufacturing is gradually developing towards HDI (High Density Interconnection), which is highly integrated and interconnected with circuit density. However, whether it is the traditional printed circuit board (PCB) or the current HDI board, when the selective nickel-gold process is carried out, the dry film is used to selectively select nickel-gold, that is, after lamination (dry film), exposure , development, vol...

AI Technical Summary

Problems solved by technology

However, whether it is the traditional printed circuit board (PCB) or the current HDI board, when the selective nickel-gold process is carried out, the dry film is used to selectively select nickel-gold, that is, after lamination (dry film), exposure , development, volcanic ash pretreatment (Pumice), nickel-gold, and film removal, a total of 6 processes, the production process is very complicated, and the production cycle is long and the cost is high, which is not conducive to market development

Images