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Filling-free polyimide bonding agent applicable to once coating

A polyimide sticky and filler-free technology, which is applied in the direction of adhesives, etc., can solve the problems of low production efficiency and achieve the effects of high adhesion, high efficiency and high heat resistance

Active Publication Date: 2009-11-04
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, multiple coatings are generally required in the production of two-layer flexible printed circuit boards, which makes the production efficiency relatively low

Method used

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  • Filling-free polyimide bonding agent applicable to once coating
  • Filling-free polyimide bonding agent applicable to once coating
  • Filling-free polyimide bonding agent applicable to once coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Put 200ml of dimethylacetamide (DMAC) into a 500ml reactor equipped with a water jacket, stir at a constant speed at a speed of 200r / min, slowly mix 7.45g (2.357mol) of p-phenylenediamine (PPDA), diamine Add 3.95g (0.681mol) of diphenyl ether (ODA) and 6.83g (0.572mol) of 4,4'-diaminobenzophenone into the reactor, keep the temperature at 20°C, stir for 2h, and then slowly add bis 15.21g (1.76mol) of benzenecarboxylic dianhydride (BPDA) and 16.65g (1.76mol) of pyromellitic dianhydride (PMDA), the stirring speed was adjusted to 300r / min to continue stirring, and the reaction was stopped after 3h.

[0024] Coat the polyamic acid solution obtained above on a copper foil manufactured by Nippon Mining Co., Ltd., model: BHY22BT, with a thickness of 18um, and then bake it at 160°C for 10 minutes, and under nitrogen protection, respectively at 120°C, Heating at 160°C, 200°C, 250°C, 300°C, and 380°C for 20 minutes, the polyamic acid can be amidated to form a polyimide film with a...

Embodiment 2

[0026] Put 200ml of dimethylacetamide (DMAC) into a 500ml reactor equipped with a water jacket, stir at a constant speed at a speed of 200r / min, slowly mix 7.45g (2.357mol) of p-phenylenediamine (PPDA), diamine Add 3.95g (0.681mol) of diphenyl ether (ODA) and 6.83g (0.572mol) of 4,4'-diaminobenzophenone into the reactor, keep the temperature at 20°C, stir for 2h, and then slowly add bis 24.33 g of pyromellitic dianhydride (BPDA) and 6.66 g of pyromellitic dianhydride (PMDA), the stirring speed was adjusted to 300 r / min to continue stirring, and the reaction was stopped after 3 hours.

[0027] Coat the polyamic acid solution obtained above on a copper foil manufactured by Nippon Mining Co., Ltd., model: BHY22BT, with a thickness of 18um, and then bake it at 160°C for 10 minutes, and under nitrogen protection, respectively at 120°C, Heating at 160°C, 200°C, 250°C, 300°C, and 380°C for 20 minutes, the polyamic acid can be amidated to form a polyimide film with a thickness of 25um...

Embodiment 3

[0029] Put 200ml of dimethylacetamide (DMAC) into a 500ml reactor equipped with a water jacket, stir at a constant speed at a speed of 200r / min, slowly mix 7.45g (2.357mol) of p-phenylenediamine (PPDA), diamine Add 3.95g (0.681mol) of diphenyl ether (ODA) and 6.83g (0.572mol) of 4,4'-diaminobenzophenone into the reactor, keep the temperature at 20°C, stir for 2h, and then slowly add diphenyl Ketonetetracarboxylic dianhydride (BTDA) 18.04g and pyromellitic dianhydride (PMDA) 6.66g, the stirring speed was adjusted to 300r / min to continue stirring, and the reaction was stopped after 3h.

[0030] Coat the polyamic acid solution obtained above on a copper foil manufactured by Nippon Mining Co., Ltd., model: BHY22BT, with a thickness of 18um, and then bake it at 160°C for 10 minutes, and under nitrogen protection, respectively at 120°C, Heating at 160°C, 200°C, 250°C, 300°C, and 380°C for 20 minutes, the polyamic acid can be amidated to form a polyimide film with a thickness of 25um...

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Abstract

The invention discloses a filling-free polyimide bonding agent applicable to once coating, which is characterized by comprising tetrabasic carboxylic acid dianhydride, aromatic diamine and solvent, wherein the weight ratio of the tetrabasic carboxylic acid dianhydride to the aromatic diamine is 1:0.7-1.3; the tetrabasic carboxylic acid dianhydride is selected from at least two of diphenyl tetrabasic carboxylic acid dianhydride, diphenyl ketone tetrabasic carboxylic acid dianhydride and pyromellitic dianhydride; and the aromatic diamine is selected from at least two of para-phenylene diamine, 4,4'-aminobenzophenone, 4,4'-eiaminodiphenylether, methylenedi-anilien and 4,4'-diaminobenzanilide or lentine. The polyimide bonding agent aims to overcome the defects of the prior art and provide a filling-free polyimide bonding agent applicable to once coating. In a production process, double-layer flexible copper-clad plates with high heat resistance, high cohesive property and flatness and good light transmittance can be produced by only coating the filling-free polyimide bonding agent once.

Description

technical field [0001] The invention relates to a filler-free polyimide adhesive suitable for one-time coating, in particular to a two-layer flexible copper-clad laminate with high heat resistance, high adhesion and high flatness for one-time coating production Filler-free polyimide adhesive. Background technique [0002] The continuous development of portable electronic communication and information products, as well as the high-density IC packaging requirements of semiconductors, drive the continuous development of flexible boards, especially the high-density flexible boards have irreplaceable importance in the application of electronic and electrical applications due to their special characteristics. . With the development of multi-functional and miniaturized electronic products, more functions need to be carried on the circuit board, and the circuit is becoming smaller and smaller, so the corresponding two-layer flexible printed circuit board with high thermal dimension...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08
Inventor 漆小龙张正浩张家骥陈政心
Owner ALLSTAE TECH ZHONGSHAN