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Copper and copper alloy surface conditioning agent

A surface treatment agent, copper alloy technology, applied in the direction of metal material coating process, etc., can solve the problems of weak alkalinity, unfavorable appearance of printed circuit boards, etc., and achieve the effect of prolonging the service life

Active Publication Date: 2009-11-11
林原标
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] (2) Alkaline environment is an important condition to avoid the Galvanic effect. The prior art needs to use organic solvents such as alcohols as cosolvents, and its operating environment is relatively alkaline, which is not conducive to ensuring better PCB Appearance

Method used

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  • Copper and copper alloy surface conditioning agent
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  • Copper and copper alloy surface conditioning agent

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with specific embodiments, but the protection scope of the present invention is not limited thereto.

[0023] The present invention can be used as a prepreg when applied to the organic solder protection film process for printed circuit boards. The aqueous solution of the prepreg contains 0.85% xanthine by weight, 5.1% by weight of sodium carbonate, and 0.8% by weight of Sodium hydroxide, ammonium bromide with a weight ratio of 0.038%, the pH value is adjusted to 11, and the temperature is set at 25°C.

[0024] In the process of organic solder protection coating film for printed circuit boards, acidic or alkaline cleaners are used to remove oil stains on the surface of printed circuit boards, and after washing with water, the surface of copper or copper alloys is roughened with sulfuric acid / hydrogen peroxide microetching solution to improve organic Adhesion of solder protection film on copper or copper...

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PUM

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Abstract

The invention belongs to the technical field of surface treatment of metallic materials, and in particular relates to a copper and copper alloy surface conditioning agent. The aqueous solution of the copper and copper alloy surface conditioning agent comprises 0.02 to 5.0 weight percent of Purine compounds, 0.1 to 10.0 weight percent of inorganic base and 0.01 to 1.0 weight percent of halogen compounds. The copper and copper alloy surface conditioning agent uses the Purine compounds with high melting point to replace benzimidazoles compounds with low melting point used in the prior art; a printed circuit board treated by the copper and copper alloy surface conditioning agent can endure high-temperature encapsulation more and adapt to the surface mounting technology (SMT) for times, Galvanic effect is not easy to cause, and good appearance of the printed circuit board can be guaranteed; and the forming rate of an organic film on the surface of copper or copper alloy can be accelerated, and deposit is difficult to be generated and pollutes liquid medicines, so that the service life of the liquid medicines is prolonged.

Description

technical field [0001] The invention belongs to the technical field of metal material surface treatment, in particular to a copper and copper alloy surface treatment agent. Background technique [0002] In order to treat the copper and copper alloy surface of printed circuit boards, U.S. Patent No. 6,524,644 once proposed an organic solder prepreg process using benzimidazole benzimidazole at an alkaline pH of 8 to 9, but benzimidazole is water-soluble Therefore, alcohols such as 20% by weight of isopropanol are used as cosolvents to dissolve benzimidazoles, triisopropanol ammonia is used as corrosion inhibitors, and ammonia salts such as ammonium acetate are used as buffers. Other benzimidazoles with substituents have very poor solubility in alcohols, so they cannot be applied to alkaline conditions. In actual production, it is found that it has the following defects: [0003] (1) The above-mentioned benzimidazole compound has a low melting point (about 250°C), and when th...

Claims

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Application Information

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IPC IPC(8): C23C22/63
Inventor 林原标
Owner 林原标
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