Location test system for defects of integrated circuit and implementation method thereof

Abstract

The invention provides a location test system for defects of an integrated circuit and an implementation method thereof, belonging to the field of electronic test equipment, and relating to a system for locating and testing the defects of the integrated circuit and an implementation method thereof. The system mainly comprises a control analysis unit, a laser generator, a laser distribution device,a laser scanning device, an acoustic oscillation generator, an optical microscope device, a sample electrification module, a weak light detection device, a rated current voltage measurement device, arated voltage current measurement device, a damping platform, a darkroom case, and the like. Due to the adoption of the invention, the physical position of various defects of the integrated circuit can be located intuitively, and the defects of the integrated circuit can be found in time and accurately so as to improve the product quality, accelerate the speed of research and development and improve the production technique level.

Description

technical field [0001] The invention belongs to the field of electronic testing equipment, and relates to a system for positioning and testing integrated circuit defects and a method for realizing the system. Background technique [0002] For the defect location of integrated circuits, low-light radiation location technology is generally used at present. This technology uses the electron-hole pair coupling at the defect site to release photons to detect the failure point. This technology has obvious limitations. , short circuit, and defect points under the aluminum wire covering parts cannot be located. [0003] The present invention innovates defect location technology by combining ultrasonic and laser beams (for example: wavelength: 1.3um, energy: 100mW, focus point: 0.65um) to scan silicon crystals, resulting in local heating, and using ultrasonic waves to strengthen heat accumulation Effect, and observe its current change to locate the defect points that may have proble...

AI Technical Summary

Problems solved by technology

[0002] For the defect location of integrated circuits, low-light radiation location technology is generally used at present. This technology uses the electron-hole pair coupling at the defect site to release photons to detect the failure point. This technology has obvious limitations. , short circuit, and defect points below the aluminum wire covering parts cannot be located

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