Curved surface bondline thickness full-field detection device and detection method thereof

A detection device and curved surface technology, applied in the field of micro-optics, can solve problems such as inability to guarantee precision and accuracy, and lack of photoresist thickness distribution, so as to achieve the effect of ensuring measurement accuracy

Inactive Publication Date: 2009-12-09
ZHEJIANG UNIV
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Problems solved by technology

The ellipsometer method has high measurement accuracy and is suitable for the detection of flat adhesive layers; but in the measurement of curved surface adhesive layers, the accuracy and accuracy cannot be guaranteed, and the results need to be corrected after measurement
Therefore, the thickness measurement of the curved surface is technically a blank, and there is no specific method to obtain the thickness distribution of the photoresist

Method used

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  • Curved surface bondline thickness full-field detection device and detection method thereof
  • Curved surface bondline thickness full-field detection device and detection method thereof
  • Curved surface bondline thickness full-field detection device and detection method thereof

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Embodiment Construction

[0022] Such as figure 1 and figure 2 As shown, the full-field detection device for curved surface glue thickness of the present invention mainly includes a tunable laser 1, a lens 2, a beam splitting prism 3, a lens 4 and a photoelectric detection array CCD5. Wherein, the lens 2 is placed between the tunable laser 1 and the beam-splitting prism 3, the beam-splitting prism 3 is placed between the lens 2 and the lens 4, and the beam-splitting prism 3 is placed between the lens 4 and the photodetection array CCD5. Thus, the outgoing light output by the tunable laser 1 is expanded into a surface light source through the lens 2, so as to increase the measurement range of the curved surface to be inspected; the expanded light is reflected to the lens 4 through the beam splitter 3, and after the light passes through the lens 4, it is Reflection from the surface to be inspected; the light reflected from the surface to be inspected returns along the original optical path, passes thro...

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Abstract

The invention discloses a curved surface bondline thickness full-field detection device and a detection method thereof. The detection device comprises a tunable laser, a lens, a dispersion prism, a lens and a photodetector array CCD, wherein emergent light of the tunable laser passes through the lens and the dispersion prism and then is reflected to the lens, the light is reflected on a surface to be detected after passing through the lens; and the light reflected on the surface to be detected is returned in an original path, passes through the lens and the dispersion prism and illuminates on the photodetector array CCD. The bondline thickness distribution is calculated according to a reflected light energy ratio variation obtained on the photodetector array CCD 5; and a bondline reflectivity is solved according to a measuring principle so as to calculate the bondline thickness distribution. The device and the method can losslessly detect photoresist full-field thickness distribution on a curved substrate, are suitable for photoresist thickness detection when a microstructure of the curved substrate is process by a photoetching method, and are also suitable for film thickness measurement of other curved substrates.

Description

technical field [0001] The invention relates to a full-field measurement method for the photoresist thickness on a curved substrate, and belongs to the field of micro optics. Background technique [0002] With the development of lithography technology, curved surface laser direct writing technology has become a new direction for the development of lithography technology. The thickness distribution of the surface adhesive layer determines the effect of the final three-dimensional relief microstructure. Theoretically, the adhesive thickness distribution of the curved surface substrate is uneven, and the unevenness is related to the curvature of the substrate, so it is necessary to obtain the accurate thickness distribution of the adhesive layer. [0003] Among the existing measurement techniques, the step meter method and the ellipsometer method are more suitable for the measurement of glue thickness. The pedometer method is a stress method, which destroys the surface of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06
Inventor 梁宜勇张春晖陈龙江罗剑波
Owner ZHEJIANG UNIV
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