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Window-type ball grid array packaging structure and manufacturing method thereof

A technology of ball grid array and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as chip fragmentation and reduce package thickness, and achieve the effect of reducing the risk of exposed bonding wires

Inactive Publication Date: 2011-02-09
POWERTECH TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the main purpose of the present invention is to provide a window-type ball grid array package structure and its manufacturing method, which can reduce the thickness of the entire package, and can effectively solve the problem of delamination on the chip side of the traditional window-type ball grid array package structure. , delamination, or chipping on the side of the die

Method used

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  • Window-type ball grid array packaging structure and manufacturing method thereof
  • Window-type ball grid array packaging structure and manufacturing method thereof
  • Window-type ball grid array packaging structure and manufacturing method thereof

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no. 1 Embodiment

[0071] According to the first specific embodiment of the present invention, a window type ball grid array package structure is illustrated in figure 2 cross-sectional schematic diagram.

[0072] see figure 2 As shown, the window type ball grid array package structure 200 mainly includes a substrate 210, a first chip 220, a die-bonding material 230, two or more first bonding wires 240, an encapsulant 250, and two or more external connections. Terminal 260. The substrate 210 has an inner surface 211, an outer surface 212, a die-bonding depression 213 formed on the inner surface 211, and a slot 214, and the slot 214 runs through the outer surface 212 to the die-bonding depression 213. The inner surface 211 is the surface of the substrate 210 not exposed to the encapsulant 250 for disposing the first chip 220 ; the outer surface 212 is the surface exposed to the encapsulant 250 for disposing the external terminals 260 . The slot 214 can be a central slot for exposing two or m...

no. 2 Embodiment

[0087] According to the second specific embodiment of the present invention, another window type ball grid array package structure is illustrated in Figure 5 A schematic cross-sectional view of the structure of which is the same as that of the first embodiment, but more chips can be stacked.

[0088] see Figure 5 As shown, the window type ball grid array package structure 300 mainly includes a substrate 310, a first chip 320, a die-bonding material 330, two or more first bonding wires 341, an encapsulant 350, and two or more external connections. Terminal 360. The substrate 310 has an inner surface 311 , an outer surface 312 , a die-bonding recess 313 formed on the inner surface 311 , and a slot 314 , and the slot 314 passes through the outer surface 312 to the die-attaching recess 313 . The substrate 310 can have a stepped notch 315 formed on the outer surface 312 and the side of the slot 314 . In this embodiment, two or more first fingers 316 may be formed on the outer ...

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Abstract

The invention discloses a window-type ball grid array packaging structure, which mainly comprises a base plate, a chip, an adhesive crystal material, two or more bonding wires for electrically connecting the chip and the base plate, an adhesive body for sealing the chip, and two or more external terminals arranged below the base plate, wherein the base plate is provided with an adhesive crystal pit on which the adhesive crystal material is formed and a slotted hole for passing through the bonding wires, and the chip is aligned to the adhesive crystal pit and is arranged on the base plate. Theinvention also discloses a method for manufacturing the window-type ball grid array packaging structure, and in a step of adhesive crystal diffusion, the adhesive crystal pit limits the expansion shape of the adhesive crystal material so that the adhesive crystal material is filled the gap between the lateral surface of the chip and the edge of the adhesive crystal pit. Thus, the packaging structure has reduced packaging thickness and can avoid the smashed layering of the lateral surface of the chip.

Description

technical field [0001] The present invention relates to a semiconductor device, in particular to a window-type ball grid array package structure and a manufacturing method thereof. Background technique [0002] Among the package types of many semiconductor devices, the package structure of window ball grid array (WBGA, Window BallGrid Array) is to open the substrate used to carry the chip with through slots, so that the wires can pass through the slots for electrical protection. The substrate is connected to the chip above it, and external terminals such as solder balls are bonded to the bottom of the substrate, so that the window type ball grid array package structure can be electrically connected to the outside. Once the chip is pasted on the substrate with a liquid or viscous die-bonding material, the die-bonding material will have fluidity and overflow during the heating and pressure process of the die-bonding material, and when the die-bonding material flows and covers ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/488H01L23/498H01L23/31H01L21/50H01L21/60H01L21/58H01L21/56
CPCH01L2924/16195H01L2924/15311H01L2225/0651H01L2924/0105H01L2924/01029H01L24/32H01L2224/32014H01L2924/01013H01L2924/01005H01L2924/01033H01L2924/01075H01L2924/01082H01L2224/32225H01L2924/01079H01L2224/73215H01L2224/4824H01L2924/01015H01L2224/48091H01L2225/06565H01L2224/73265H01L2225/06558H01L2924/01006H01L25/0657H01L2224/32145H01L2924/14H01L2224/06136H01L2924/181H01L2924/351
Inventor 陈锦弟
Owner POWERTECH TECHNOLOGY INC