A rare earth-containing halogen-free sn-ag-cu solder paste

A solder paste and halogen technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of poor refinement of alloy solder powder, low elongation of alloy solder powder, poor mechanical properties of solder paste, etc. , to achieve the effect of less residue after welding, long storage life and low cost

Active Publication Date: 2012-02-22
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the alloy solder powder of this solder paste has a poor degree of refinement, uneven distribution, low elongation of the alloy solder powder, and poor mechanical properties of the solder paste.

Method used

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  • A rare earth-containing halogen-free sn-ag-cu solder paste
  • A rare earth-containing halogen-free sn-ag-cu solder paste
  • A rare earth-containing halogen-free sn-ag-cu solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The preparation method of the rare earth-containing halogen-free Sn-Ag-Cu based solder paste described in Example 1 is as follows: take the solder paste components in parts by weight of Example 1 in Table 1, and mix rosin and its derivatives, organic acid The active agent, surfactant, solvent, and antioxidant materials are sequentially added into the container for heating, and the temperature is not higher than 100°C, stirred and dissolved, and then cooled to room temperature. Add thixotropic agent, disperse at high speed to 70°C, and then cool to room temperature to obtain solder paste.

[0033] Then 12.5% ​​by weight of solder paste and 87.5% by weight of alloy solder powder were evenly stirred to obtain the rare earth-containing halogen-free Sn—Ag—Cu based solder paste described in Example 1.

Embodiment 2

[0034] The preparation method of the rare-earth-containing halogen-free Sn-Ag-Cu system solder paste described in Example 2 is: take the solder paste components by weight in Example 2 in Table 1, and all the other processes are the same as in Example 1, and no longer To repeat, get the solder paste.

[0035] Then 11.5% by weight of solder paste and 88.5% by weight of alloy solder powder were evenly stirred to obtain the rare earth-containing halogen-free Sn—Ag—Cu solder paste described in Example 2.

Embodiment 3

[0036] The preparation method of the rare-earth-containing halogen-free Sn-Ag-Cu based solder paste described in Example 3 is as follows: take the solder paste components in parts by weight of Example 3 in Table 1, and all the other processes are the same as in Example 1, and no longer To repeat, get the solder paste.

[0037] Then 10.5% by weight of solder paste and 89.5% by weight of alloy solder powder were stirred evenly to obtain the rare earth-containing halogen-free Sn—Ag—Cu solder paste described in Example 3.

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PUM

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Abstract

The invention provides a rare earth-containing halogen-free Sn-Ag-Cu solder paste. It solves the problems that existing solder paste products contain halides, have poor environmental performance and poor mechanical properties. The rare earth-containing halogen-free Sn-Ag-Cu solder paste is composed of the following components by weight percentage: alloy solder powder: 85% to 90%, solder paste: 10% to 15%; wherein the alloy solder powder is composed of the following weight percentages: Composition by percentage: Ag: 1.0% to 5.0%, Cu: 0.1% to 1.0%, rare earth elements: 0.025% to 1.5%, and the rest is Sn. The rare earth-containing halogen-free Sn-Ag-Cu solder paste is environmentally friendly, non-toxic, low in cost, high in stability, good in strength, fatigue resistance and plasticity, and has excellent solubility and durability.

Description

technical field [0001] The invention relates to a solder paste, in particular to a rare earth-containing halogen-free Sn-Ag-Cu solder paste. It belongs to the field of surface assembly technology in the microelectronics industry. Background technique [0002] In recent years, computers, communication equipment, instruments and meters, and household appliances have developed towards miniaturization, high performance, and multi-purpose. Electronic components must also be miniaturized. The development of surface mount technology (SMT) is due to the emergence of microelectronic components and high-precision fine electronic integrated chips. The soldering methods and required soldering materials for surface mount technology (SMT) have also changed, and the use of raw material solder paste in the surface mount technology (SMT) industry has become more and more widely used, and has increasingly attracted the attention of electronics manufacturers. [0003] Traditional solder pas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 余洪桂邓勇罗建甘洋生刘婷
Owner 上海一远电子科技有限公司
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