Submicron particle reinforced Ag-based electrical contact material and preparation method thereof

A technology of sub-micron particles and electrical contact materials, applied in contacts, circuits, electrical switches, etc., can solve the problems of many pores and uneven distribution, and achieve the prevention of arc concentration, anti-welding performance and anti-arc ablation The effect of performance improvement

Active Publication Date: 2010-02-17
WENZHOU HONGFENG ELECTRICAL ALLOY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The main problem to be solved is the uneven distribution and

Method used

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  • Submicron particle reinforced Ag-based electrical contact material and preparation method thereof

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Effect test

Embodiment 1

[0033] Take the preparation of 5mm thick Ag-WC30-1Cu-1Ni material as an example

[0034] Such as figure 1 As shown, first 10kg of WC powder (with a particle size of 1 μm) was placed in 5% nitric acid solution, stirred and cleaned for 10 minutes, then washed three times with deionized water and then suction filtered.

[0035] Then implement electroless plating, pour the powder after suction filtration into 500L of hydrazine hydrate solution, the concentration is 3ml / L, adjust the pH value to 8 with ammonia water, stir and ultrasonically vibrate, and simultaneously add 500L of silver nitrate solution with a concentration of 10g / L It is added in the form of spray, the stirring speed is 20 rpm, and the ultrasonic vibration frequency is 15KHz. After the electroless plating is complete, the coated WC powder is obtained by suction filtration, and washed three times with deionized water.

[0036] After vacuum drying, the coated WC powder was placed in vacuum and dried at 100° C. for...

Embodiment 2

[0042] Take the preparation of 10mm Ag-WC80-1Ni material as an example

[0043] Such as figure 1 As shown, firstly, 30kg of WC powder (with a particle size of 0.1 μm) was placed in 20% nitric acid solution, stirred and cleaned for 30 minutes, then washed three times with deionized water and then suction filtered.

[0044]Then implement electroless plating, pour the powder after suction filtration into 500L hydrazine hydrate solution, its concentration is 6ml / L, use ammonia water to adjust the pH value to 10, stir and ultrasonically vibrate, and at the same time, 500L silver nitrate solution with a concentration of 30g / L It is added in the form of spray, the stirring speed is 200 rpm, and the ultrasonic vibration frequency is 50KHz. After the electroless plating is complete, the coated WC powder is obtained by suction filtration, and washed three times with deionized water.

[0045] After vacuum drying, the coated WC powder was placed in vacuum and dried at 150° C. for 24 hou...

Embodiment 3

[0051] Take the preparation of 20mm Ag-WC50-0.1Cu material as an example

[0052] First, 15 kg of WC powder (with a particle size of 0.5 μm) was placed in 10% nitric acid solution, stirred and washed for 10 minutes, then washed three times with deionized water and then suction filtered.

[0053] Then implement electroless plating, pour the powder after suction filtration into 500L hydrazine hydrate solution, its concentration is 4.5ml / L, adjust the pH value to 9 with ammonia water, stir and vibrate ultrasonically. At the same time, 500 L of silver nitrate solution with a concentration of 15 g / L was added in the form of spray, the stirring speed was 100 rpm, and the ultrasonic oscillation frequency was 30 KHz. After the electroless plating is complete, the coated WC powder is obtained by suction filtration, and washed three times with deionized water.

[0054] After vacuum drying, the coated WC powder was placed in vacuum and dried at 100° C. for 24 hours.

[0055] The dried ...

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Abstract

The invention discloses a submicron particle reinforced Ag-based electrical contact material and a preparation method thereof. The method comprises the following steps: adopting chemical plating method to coat silver on the surface of submicron W particles or WC particles, and then adopting pressing infiltration method to prepare dense micron particle reinforced Ag-based composite material. The material comprises the following components by weight percent: 0.1%<=Ni<=2%, 0.1%<=Cu<=2%, 30%<=W(or WC)<=80% and the balance Ag, wherein the grain size of W or WC powder is 0.01-1mu m. The material ofthe invention has good mechanical and physical properties and the reinforced phase particles are dispersed evenly. Compared with the traditional Ag-W material or Ag-WC material, the material has better fusion welding resistance, lower electric arc burning loss resistance and longer electrical life as the tiny high melting point reinforced phase is distributed evenly in the material substrate in dispersion manner.

Description

technical field [0001] The invention relates to an electrical contact material and a preparation method thereof, in particular to a submicron particle reinforced silver-based electrical contact material and a preparation method thereof. Background technique [0002] Ag-W or Ag-WC contact materials are widely used in circuit breakers due to their good electrical and thermal conductivity and excellent corrosion resistance. In recent years, various series of new molded case circuit breakers and small high-voltage circuit breakers have been continuously introduced at home and abroad. These new circuit breakers are smaller in size but have greatly improved breaking capacity. In addition to adopting a series of new current-limiting technologies to improve the breaking capacity, the new circuit breaker has higher requirements on the anti-welding resistance, arc burning resistance and electrical life of all electrical contacts. At home and abroad, in response to the above increasin...

Claims

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Application Information

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IPC IPC(8): H01H1/023H01H1/0233H01H11/04C22C5/06C22C29/08C22C27/04C22C32/00C22C30/02C22C1/04C22C1/05
Inventor 甘可可祁更新陈晓陈乐生
Owner WENZHOU HONGFENG ELECTRICAL ALLOY
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