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High heat radiating circuit substrate and manufacturing method thereof

A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems of high cost and low thermal conductivity, and achieve the effect of increasing heat dissipation rate and reducing manufacturing cost

Inactive Publication Date: 2010-02-17
大连九久光电制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional heat conduction layer is made of metal materials such as copper or aluminum, which has the following disadvantages: 1. High cost; 2. Low thermal conductivity

Method used

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  • High heat radiating circuit substrate and manufacturing method thereof
  • High heat radiating circuit substrate and manufacturing method thereof
  • High heat radiating circuit substrate and manufacturing method thereof

Examples

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Comparison scheme
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Embodiment Construction

[0036] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] Please also refer to Figure 1 to Figure 2 ,in, figure 1 is a cross-sectional view of a high heat dissipation circuit substrate according to an embodiment of the present invention; figure 2 It is a cross-sectional view of a high heat dissipation circuit substrate further provided with a plurality of fins according to an embodiment of the present invention.

[0038] As shown in the figure, the high heat dissipation circuit substrate 1 of the embodiment of the present invention includes: a conductive circuit layer 10 ; an insulating layer 20 ; and a graphite heat conducting layer 30 .

[0039] Wherein, the conductive circuit layer 10 can be used to place at least one electronic component 40 , such as but not limited to a chip of a high-brightness LED, and has a circuit (not shown) thereon to connect the electronic component 40 . The conductiv...

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Abstract

The invention relates to a high heat radiating circuit substrate and a manufacturing method thereof. The high heat radiating circuit substrate comprises a conducting wire layer, an insulating layer and a graphite heat conducting layer, wherein at least one electronic component can be arranged on the conducting wire layer, and wires are arranged on the conducting wire layer for connecting the electronic component; the insulating layer is positioned at one side of the conducting wire layer; and the graphite heat conducting layer is arranged at one side of the insulating layer and can uniformly radiate the heat generated by the electronic component. The manufacturing method of the high heat radiating circuit substrate comprises the following steps: firstly, using a metallic substance or an alloy thereof to manufacture the conducting wire layer; secondly, forming at least one wire on the conducting wire layer; thirdly, using an insulating substance to manufacture the insulating layer; andfourthly, jointing the graphite heat conducting layer to the other side of the insulating layer. Since the heat conducting layer of the high heat radiating circuit substrate and the manufacturing method thereof use the graphite material, not only the manufacturing cost can be reduced, but also the heat can be radiated uniformly to increase the heat radiating rate, and the like.

Description

【Technical field】 [0001] The invention relates to the field of circuit boards and manufacturing methods, in particular to a high heat dissipation circuit substrate and a manufacturing method thereof. 【Background technique】 [0002] As oil prices continue to rise, there is a trend of energy saving and carbon saving, in order to reduce energy consumption and slow down the speed of global warming. [0003] In order to save energy and carbon, manufacturers from all over the world have taken full advantage of their rights to launch various energy-saving and carbon-saving products. For example, automobile manufacturers launch hybrid vehicles or electric vehicles; and electrical appliance manufacturers launch various environmentally friendly appliances or lamps. Among them, the most popular What is optimistic about is LED lamps, such as LED street lamps or LED bulbs. According to research, the use of LED street lamps or LED bulbs can greatly reduce power consumption, so that the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20H05K3/00H01L33/00
Inventor 蔡绮睿蒋增钦庞树军杨鹏
Owner 大连九久光电制造有限公司
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