Programmable photomask, using method thereof and application of the photomask

Abstract

The invention relates to a photomask for photoetching in semiconductor manufacture, a using method of the photomask and application of the photomask. The programmable photomask disclosed by the invention comprises a photomask body which comprises a laser array consisting of more than two lasers, wherein a control circuit connects each laser and controls the on and off states of each laser. The programmable photomask can reduce photomask cost in the industries related to semiconductors by using the laser array. Meanwhile, because a pattern is formed by laser directly, the collimation degree ishigh; an OPE effect formed in the conventional photoetching process when the high order secondary light cannot be collected by an image forming system due to the diffraction formed on the photomask bya light source is avoided; and the image quality is improved effectively.

Description

technical field [0001] The invention relates to a lithography device for semiconductor manufacturing and its usage method and application, in particular to a photomask for semiconductor manufacturing and its usage method and usage. Background technique [0002] Graphic transfer technology is the basic method in the existing integrated circuit manufacturing technology. The specific method is to transfer the pattern on the template to the device substrate layer by photolithography technology, and then manufacture the pattern by etching, filling, long film, chemical mechanical polishing and other technologies. This technology is simple and easy, and the process is mature. However, for the existing photolithography technology based on mask pattern transfer, for different devices, a corresponding specific photolithography mask needs to be manufactured each time, which greatly increases the cost of product production. [0003] At the same time, in integrated circuit manufacturin...

AI Technical Summary

Problems solved by technology

[0005] At the same time, the traditional photolithography process uses a fixed light source to irradiate a patterned mask to generate diffraction and then collects images through an imaging system. Limited by the physical effect of optical diffraction, the optical proximity effect OPE (Optical Proximity Effect) greatly restricts the actual imaging. Effect

It is necessary to correct the pattern through the complex optical proximity effect correction OPC (Optical Proximity Correction) technology, which further increases the cost of the mask

[0006] Moreover, with the end of product life, or the natural loss of photomask use, tens of thousands of photomasks are discarded every year around the world, which also forms a huge waste

Images