Monocrystal silicon-rod butting technique

Abstract

The invention relates to a monocrystal silicon-rod butt technique, comprising the following steps: selecting a round monocrystal silicon rod of which the length is 220-500 mm and the diameter is 153-160 mm, and vertically sticking the silicon rod to crystal support of a butting machine with adhesive; putting the crystal support of the butting machine and the round monocrystal silicon rod on a magnetizing workbench, numbering and recording, and magnetizing to fix the crystal support and the round monocrystal silicon rod; calibrating the positioning table, setting the cutting parameters, and starting the butting machine to carry out the sand-bearing cutting; degumming the cut semifinished product, removing the side skin and separating the crystal support; and inspecting whether the semifinished product is qualified or not. The technique has favorable cutting effect and greatly increases the qualification rate and improves the working efficiency of the machine; and after the space of the guide wheels is corrected, even if the sand during the cutting is not enough, the technique can ensure the whole dimension within the range of the tolerance value.

Description

technical field [0001] The invention belongs to the technical field of photovoltaics, and in particular relates to a single crystal silicon rod cutting process for the production of modern single crystal silicon wafers. Background technique [0002] With the promotion of green energy worldwide and the rapid development of the semiconductor industry in recent years, the supply and demand of the silicon wafer market has become extremely unbalanced. The backward cutting and processing capabilities and the serious shortage of production capacity have constituted the bottleneck of the entire semiconductor industry chain. As a key technology in the upstream production of silicon wafers, the new silicon wafer multi-wire cutting technology that has emerged in recent years has the advantages of high cutting surface quality, high cutting efficiency, large cutting size and convenient subsequent processing. However, the Japanese NTC square cutting machine fluctuates greatly in stability...

AI Technical Summary

Problems solved by technology

However, the Japanese NTC square cutting machine fluctuates greatly in stability (after three batches of continuous cutting) during the production process. The cutting size error of the first batch and the third batch exceeds ±0.8, and the size after the third batch often Exceeding the tolerance standard, the upper and lower slopes are more than +0.6, the pass rate is only about 50%, (the unit length is about 300mm) to be qualified after re-grinding, these unqualified square bars have brought great losses to the company