Electroless nickel plating method and circuit board manufactured by same
A technology for electroless nickel plating and circuit boards, applied in printed circuits, printed circuit manufacturing, electrical components, etc. It can solve the problems of open plating, leak plating, overflow plating, etc., and achieve excellent solderability and corrosion resistance.
Inactive Publication Date: 2010-03-31
江德馨
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Problems solved by technology
If the two activities are low, it will cause missing plating or chipping due to poor plating; on the contrary, if both activities are high, it will cause penetration or overflow plating due to excessive plating
Method used
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[0027] In order to make the technical content of the present invention easier to understand, preferred specific embodiments are described as follows.
[0028] Please refer to the following figure 1 A flow chart of the method for electroless nickel plating of the present invention is shown. Such as figure 1 Shown, the method for electroless nickel plating of the present invention comprises the following steps:
[0029] First proceed to step 71: activate the catalyst on the object to be plated and control the activation tank to maintain the first copper content.
[0030] In one embodiment of the present invention, the object to be plated must first be placed in an activation tank, and palladium is used as a catalyst to activate the surface of the object to be plated, and the copper concentration in the activation bath is controlled to maintain the first copper content, the first copper content. The copper content is substantially in the range of 100ppm-180ppm, especially pref...
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The invention relates to an electroless nickel plating method and a circuit board manufactured by the method. The electroless nickel plating method comprises the following steps: placing a plated object into a first plating solution; plating a first nickel layer on the plated object, wherein the first nickel layer is nickel-phosphorous alloy; and plating a second nickel layer on the first nickel layer, wherein the second nickel layer is nickel-phosphorous alloy, and the phosphorous content of the second nickel layer is substantially lower than that of the first nickel layer. A surface platinglayer of the circuit board can be manufactured by the electroless nickel plating method, i.e. the first nickel layer and the second nickel layer are plated on a copper welding pad on the surface of the circuit board, wherein the first nickel layer is the nickel-phosphorous alloy; the second nickel layer is the nickel-phosphorous alloy; the second nickel layer is covered on the first nickel layer;and the phosphorous content of the second nickel layer is substantially lower than that of the first nickel layer. The surface plating layer of the circuit board, which is manufactured by the electroless nickel plating method, has excellent solderability and corrosion resistance.
Description
technical field [0001] The invention relates to a method for electroless nickel plating and the surface coating of a circuit board prepared by the electroless nickel plating method, in particular, it can provide a surface coating of a circuit board that can produce both excellent solderability and corrosion resistance . Background technique [0002] Electroless Nickel Plating (Electroless Nickel Plating) is a method of electroless nickel plating, also known as Autocatalytic Nickel Plating (Autocatalytic Nickel Plating), because in 1946 when A.Brenner and G.Riddell were serving in the National Bureau of Standards, they accidentally Discovered that sodium hypophosphite can reduce nickel ions, and used the term "electroless nickel plating" for the first time, and later applied for a US patent (US Patent No. 2532283). After the industrialization of electroless nickel plating technology, the initial application was mainly for corrosion protection in the chemical industry. With t...
Claims
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Inventor 江德馨
Owner 江德馨