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Method for preparing fluorescent powder colloid

A phosphor, yellow phosphor technology, applied in chemical instruments and methods, luminescent materials, semiconductor devices, etc., can solve the problems of non-luminescent chip adjustment lamps, single function, etc., achieve good consistency, uniform light, and improve luminous quality Effect

Inactive Publication Date: 2010-05-12
东莞市永兴电子科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0007] In order to overcome the shortcomings of the existing LED lamp packaging colloids, which have single functions and cannot be combined with light-emitting chips to adjust the light color of the lamp, the present invention provides a method for preparing fluorescent powder colloids. The products obtained by this method have high lighting quality and consistent lighting. Well, the colloid glows as a whole

Method used

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Examples

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Embodiment

[0033] Concrete processing steps of the present invention are:

[0034] 1) Preheat epoxy resin A at 55-65°C for 1-1.5 hours;

[0035] 2) Put the fluorescent powder, epoxy resin agent A and curing agent B agent in a mass-number ratio of 10:100:100 into a mixer, and mix them uniformly at a stirring rate of 30 rpm for 10 minutes;

[0036] 3) Vacuumize the mixture of fluorescent powder, epoxy resin agent A and curing agent B at a temperature of 80°C for 10 minutes at 100-110 Pa to remove bubbles in the melted mixture to obtain a finished product.

[0037] The above-mentioned epoxy resin A agent and curing agent B agent are composed of epoxy resin A and curing agent B agent in a mass ratio of 1:1.

[0038]The above-mentioned phosphor is yellow phosphor, its excited peak wavelength is between 455-465nm, and the light-emitting peak wavelength of the blue LED chip is 460-462.5nm. According to the international standard 1931CIE color map, the best range for generating white light is, ...

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Abstract

The invention discloses a method for preparing fluorescent powder colloid. The method comprises the following processing steps: 1) preheating an epoxy resin A agent for 1 to 1.5 hours at the temperature of between 55 and 65 DEG C; 2) putting fluorescent powder, the preheated epoxy resin A agent and a curing agent B into a mixer in a mass ratio of 6-15: 100: 100, and evenly mixing the materials for 10 to 15 minutes at the stirring rate of 30 to 40rpm; and 3) vacuumizing the mixture for 5 to 10 minutes at the temperature of between 75 and 85 DEG C to remove bubbles in the mixture so as to obtain a finished product. The fluorescent powder, the epoxy resin A agent and the curing agent B are evenly mixed to prepare the fluorescent powder colloid so that the fluorescent powder is evenly dispersed in the fluorescent powder colloid; the fluorescent powder colloid applied to a product can remarkably improve the luminous quality, has even rays, good consistency and high excitation efficiency, enables a whole light-emitting diode to emit light in 360 degrees, and has no ray loss.

Description

technical field [0001] The invention relates to a method for preparing fluorescent powder colloid, in particular to a method suitable for potting and encapsulating electronic components, especially light-emitting diodes, so that the light-emitting diodes emit light with uniform color. Background technique [0002] LED comes from the abbreviation of LIGHT EMITTING DIODE in English, which means light-emitting diode. The structure of the simplest light-emitting diode includes a P-type semiconductor, an N-type semiconductor and a PN junction formed between them. When the current passes through the diode, charge carriers are generated at the above-mentioned PN junction, that is, electrons and Holes, electrons combine with holes and release energy in the form of photons. Adding specific chemicals at the PN junction can make the diode emit light of a specific color, such as adding indium gallium nitride (InGaN) to produce blue light, adding gallium nitride (GaN) to produce green l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C09K11/00H01L33/50
Inventor 杨瑞焌
Owner 东莞市永兴电子科技有限公司
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