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High-Tg high-thermal conductivity aluminium-based copper-clad laminate

An aluminum-based copper cladding, high thermal conductivity technology, applied in layered products, metal layered products, chemical instruments and methods, etc. and other problems, to achieve the effect of large thermal conductivity and high power

Inactive Publication Date: 2010-06-09
DANYANG YONGHE ELECTRICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Aluminum-based copper-clad laminates have good thermal conductivity, electrical insulation and mechanical processing properties, so they are widely used in automotive electronics, computer equipment, communication electronics, power supplies, electronic controls and LED circuit boards. The production process is: use aluminum plate, glass fiber cloth semi-adhesive sheet (insulation layer) and copper foil to form the book by hot pressing. The disadvantage of this method is that the glass fiber cloth is hot. Large resistance and poor heat dissipation, it is difficult to meet the requirements of high power and high heat dissipation products

Method used

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  • High-Tg high-thermal conductivity aluminium-based copper-clad laminate

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specific Embodiment approach

[0017] A high Tg high thermal conductivity aluminum-based copper-clad laminate, including a copper layer and an aluminum layer, an insulating layer is coated between the copper layer and the aluminum layer, and the composition of the insulating layer includes epoxy resin, dimethyl Imidazole, propylene glycol methyl ether and filler, wherein the mass percentage of each composition is: epoxy resin 55-73%, dimethylimidazole 0.06-0.20%, propylene glycol methyl ether 10-22.94% and filler 10-22%.

[0018] Above-mentioned epoxy resin is the epoxy resin of a kind of brominated multifunctional two-component system, wherein, the two-component of described epoxy resin is component A and component B, wherein component A and component The mass percentage between B is: 1:0.45~0.56, and the appearance of component A is dark yellow or brownish yellow liquid, epoxy equivalent is 200~220g / eq, solid content is 82±1wt%, bromine content is 0 , the viscosity is 2000-3000; the appearance of the comp...

Embodiment 1

[0021] A high Tg high thermal conductivity aluminum-based copper-clad laminate, including epoxy resin, dimethylimidazole, propylene glycol methyl ether and fillers, wherein the mass percentage of each composition is: epoxy resin 55.00%, dimethyl Imidazole 0.06%, propylene glycol methyl ether 22.94%, filler 22.00%, and epoxy resin includes component A and component B, wherein, the mass percentage of component A and component B is 1: 0.45, and filler is 100% Silica powder.

Embodiment 2

[0023] A high Tg high thermal conductivity aluminum-based copper-clad laminate, including epoxy resin, dimethylimidazole, propylene glycol methyl ether and fillers, wherein the mass percentage of each composition is: epoxy resin 73.00%, dimethyl Imidazole 0.20%, propylene glycol methyl ether 10.00%, filler 17.80%, and epoxy resin comprises component A and component B, wherein, the mass percent of component A and component B is 1: 0.50, and filler is silicon micropowder and The mixture of boron nitride, the mass percentage of silicon micropowder and boron nitride is 0.7:0.3.

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Abstract

The invention discloses a high-Tg high-thermal conductivity aluminium-based copper-clad laminate comprising a copper foil layer and an aluminium-based layer, and an insulating layer is coated between the copper foil layer and the aluminium-based layer. The copper-clad laminate is characterized in that the insulating layer contains the components in percent weight: 55-73 percent of epoxide resin, 0.06-0.20 percent of dimethyl imidazole, 10-22.94 percent of propylene glycol methyl ether and 10-22 percent of stuffing. The aluminium-based copper-clad laminate material has the characteristics of temperature resistance, pressure resistance and big coefficient of heat conductivity and can well satisfy the requirements of high-power aluminium-based copper plates.

Description

technical field [0001] The invention relates to an aluminum-based copper-clad laminate, in particular to an aluminum-based copper-clad laminate with high Tg and high thermal conductivity. Background technique [0002] Aluminum-based copper-clad laminates have good thermal conductivity, electrical insulation and mechanical processing properties, so they are widely used in automotive electronics, computer equipment, communication electronics, power supplies, electronic controls and LED circuit boards. The production process is: use aluminum plate, glass fiber cloth semi-adhesive sheet (insulation layer) and copper foil to form the book by hot pressing. The disadvantage of this method is that the glass fiber cloth is hot. Large resistance and poor heat dissipation, it is difficult to meet the requirements of high power and high heat dissipation products. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the purpose of the present inve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/092C08L63/00C08K13/02C08K5/3445C08K5/06
Inventor 王永和
Owner DANYANG YONGHE ELECTRICAL TECH
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