Method for improving process window of self-aligned cell module in SONOS technology

A process window and self-alignment technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of improving the process window

Active Publication Date: 2010-06-16
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Obviously it is very challenging to improve the process window of the whole module

Method used

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  • Method for improving process window of self-aligned cell module in SONOS technology
  • Method for improving process window of self-aligned cell module in SONOS technology
  • Method for improving process window of self-aligned cell module in SONOS technology

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Embodiment Construction

[0013] The core step of the present invention is to adopt undoped oxide film as the pre-metal dielectric interlayer film medium, adopt phosphoric acid glass as field isolation medium, introduce oxide film and nitride film to eliminate the influence of P element diffusion in phosphoric acid glass on the device At the same time, the use of a special etching process makes it possible to have a high selectivity ratio of undoped oxide film to shallow trench isolation STI phosphoric acid glass when etching self-aligned holes. In this way, a series of process difficulties caused by the flower pattern introduced when phosphate glass is used as the pre-metal dielectric interlayer film medium can be avoided, thereby greatly improving the process window of the entire module.

[0014] The main process flow of the present invention (film layer structure and dry etching process) includes: the first step, after the first layer of oxide film is grown in the traditional shallow trench isolation...

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Abstract

The invention discloses a structure for improving a process window of a self-aligned cell module in SONOS technology and a manufacturing method thereof. The structure is characterized in that: the structure comprises film layer structures of a shallow trench isolation module and a self-aligned cell etching (SACE) module; a non-doped oxidation layer is adopted as an interlayer film medium; and phosphate glass is adopted as a field space medium. The method can avoid a series of process difficulties brought by flower pattern introduced when the phosphate glass is used as a PMD interlayer film medium, so that the process window of the whole module is improved greatly.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing. Background technique [0002] At present, the film layer structure of the advanced SONOS (silicon oxynitride silicon) self-aligned empty module is usually composed of undoped oxide film and phosphoric acid glass ( figure 2 ). Its advantage is that by introducing the special pre-metal dielectric of phosphate glass and the special dry etching process, it has a high selectivity ratio of phosphate glass to undoped oxide film, omitting the nitrogen necessary in the traditional process The compound etching barrier layer is used to further reduce the chip area and improve the integration level of the product. However, the "bud-shaped shell" brought about by this structure has brought great challenges to the entire process module. In order to meet the requirements, other important process steps such as the size of the metal gate, the film thickness of the sidewall dielectr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L21/311
Inventor 王函
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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